Abstract: An electronic component is disclosed. In an embodiment, the electronic component includes a plurality of functional layers arranged one on top of the other forming a stack, first inner electrodes, and second inner electrodes, each of the first and second inner electrodes arranged between two adjacent functional layers. The electronic component further includes a first outer contact electrically connected to the first inner electrodes and a second outer contact electrically connected to the second inner electrodes, wherein the functional layers are selected such that the first and second outer contacts are electrically conductively connected to one another via the functional layers both in a basic state and in a hot state of the electronic component, wherein a temperature of the hot state is higher than a temperature of the basic state, and wherein the electronic component is an NTC component.

Abstract: A semiconductor device includes a semiconductor component on a carrier body that includes a ceramic body and a thermistor sensor structure directly connected to the ceramic body. The thermistor sensor structure is integrated into the carrier body and includes a heat sink, on which the carrier body is mounted.

Abstract: An electronic component and a method for producing an electrical component are disclosed. In an embodiment, the electronic component includes a functional body having a first surface and a second surface, wherein the second surface faces away from the first surface, and a contact electrically linked to the first surface, the contact having an edge region and a central region, wherein the functional body has a first electrical resistance between the first surface and the second surface in a first functional body portion, which overlaps the edge region of the contact as viewed in a plan view of the electronic component, that is greater than a second electrical resistance between the first surface and the second surface in a second functional body portion, which overlaps the central region of the contact as viewed in a plan view of the electronic component.

Abstract: The multi-layer component has a main body (1) made of ceramic layers (2) and two-dimensional inner electrodes (3, 3a, 3b, 3c) in an alternating sequence. Outer electrodes (4, 4a) which are separate from each other are located on the outer surfaces (5, 5a) of the main body. The inner electrodes each have a connecting region and an overlapping region adjacent thereto. A rectilinear edge (16) of the connecting region is connected in an electrically conductive manner to one of the outer electrodes. The overlapping region is arranged at distances (6, 6a) from the outer electrodes. The edge of the connecting region that is connected to the outer electrode is at least as long as the extent of the overlapping region along straight lines running parallel to said edge, and the overlapping region is multiply interrupted at least along a number of said straight lines.

Abstract: A method for producing an electric component (19) is specified, wherein in a step A) a body (1) having at least one cavity (7, 8) is provided. In a step B), the cavity (7, 8) is at least partly filled with a liquid insulation material (13) by means of capillary forces. Furthermore, an electric component (19) is specified wherein a cavity (7, 8) is at least partly filled with an insulation material (13). The insulation material (13) is introduced into the cavity (7, 8) by means of capillary forces. Furthermore, an electric component (19) is specified wherein a cavity (7, 8) is at least partly filled with an organic insulation material (13) and wherein the cavity is at least partly covered by a fired external contacting (17, 18).

Abstract: A semiconductor device includes a semiconductor component on a carrier body that includes a ceramic body and a thermistor sensor structure directly connected to the ceramic body. The thermistor sensor structure is integrated into the carrier body and includes a heat sink, on which the carrier body is mounted.

Abstract: A piezoelectric actuator of a multilayer design includes outer electrodes that are fastened by means of a bonding layer applied by thermal spraying. For example, the outer electrodes are formed as a woven wire fabric. Furthermore, a method for fastening an outer electrode in a piezoelectric actuator is specified.

Abstract: A method of producing a ceramic component includes a) providing a main body having internal electrodes, outer edges of which are located on at least one first outer surface of the main body, b) contacting the first outer surface of the main body with a composition including an electrophoretically mobile insulating material and electrophoretically depositing the insulating material on outer edges of the internal electrodes on the first outer surface of the main body, and c) producing an insulating layer from the insulating material on the outer edges of the internal electrodes.

Abstract: A piezoelectric actuator of a multilayer design includes outer electrodes that are fastened by means of a bonding layer applied by thermal spraying. For example, the outer electrodes are formed as a woven wire fabric. Furthermore, a method for fastening an outer electrode in a piezoelectric actuator is specified.

Abstract: A method of producing a fully active multilayer element including producing a fully active stack, and optionally sintering of the fully active stack or a green precursor thereof; applying outer electrodes onto sides A? and C? of the fully active stack and contacting of the uncoated inner electrodes so that the two outer electrodes electrically connect to the uncoated inner electrode layers.

Abstract: A method for producing a multilayer component (21) is specified, which involves providing a body having dielectric layers (3) arranged one above another and first and second electrically conductive layers (4, 84, 5, 85) arranged therebetween. The first conductive layers (4, 84) are connected to a first auxiliary electrode (6) and the second conductive layers (5, 85) are connected to a second auxiliary electrode (7). The body (1, 81) is introduced into a medium and a voltage is applied between the first and second auxiliary electrodes (6, 7) for producing a material removal. Furthermore, a multilayer component is specified, which has depressions (20) formed by an electrochemically controlled material removal.

Abstract: The multi-layer component has a main body (1) made of ceramic layers (2) and two-dimensional inner electrodes (3, 3a, 3b, 3c) in an alternating sequence. Outer electrodes (4, 4a) which are separate from each other are located on the outer surfaces (5, 5a) of the main body. The inner electrodes each have a connecting region and an overlapping region adjacent thereto. A rectilinear edge (16) of the connecting region is connected in an electrically conductive manner to one of the outer electrodes. The overlapping region is arranged at distances (6, 6a) from the outer electrodes. The edge of the connecting region that is connected to the outer electrode is at least as long as the extent of the overlapping region along straight lines running parallel to said edge, and the overlapping region is multiply interrupted at least along a number of said straight lines.

Abstract: A method can be used for producing a fully active stack. A stack has the sides A, B, C and D running along the stacking direction. The method includes combining and temporarily making contact with the internal electrodes that make contact with the respective side on one of the sides B or D, such that the internal electrodes that make contact with the respective side can be electrically driven selectively. The electrically driven internal electrodes are electrochemically coated on the sides A and C. The stack is singulated to form a fully active stack with the electrochemically coated internal electrodes on the sides A? and C?. A method for producing a multilayer component comprising the fully active stack and a fully active multilayer component producible according to the method are furthermore proposed.

Abstract: A resistance component includes a stack of ceramic layers and inner electrodes. Inner electrodes of a first type are electrically conductively connected to a first external contact and inner electrodes of a second type are electrically conductively connected to a second external contact. The inner electrodes of the first type are arranged such that there is no overlap with the inner electrodes of the second type. An inner electrode of a third type, which is electrically conductively connected neither to the first external contact nor to the second external contact, at least partially overlaps the inner electrodes of the first type and the inner electrodes of the second type.

Abstract: A method for producing an electric contact-connection of a multilayer component is specified. A main body has internal electrode layers, a insulating material, an electrically conductive material and a photosensitive material are provided. The insulating material and the electrically conductive material are arranged in a structured manner on an outer side of the multilayer component for the alternate contact-connection of the internal electrode layers. The structured arrangement is produced by the photosensitive material. A multilayer component comprising such a contact-connection is furthermore specified.

Abstract: A piezoelectric component includes a main body, which is surrounded at least in part by an enclosure for protecting the main body. The enclosure includes a structured foil. A method for producing a component of this type is also specified, in which a main body of the component and a structured foil are provided. The structured foil is then wound around the main body.

Abstract: A solder material can be used for fastening an outer electrode on a piezoelectric component. The solder material contains tin as the main constituent and at least one addition from the group of cobalt, tungsten, osmium, titanium, vanadium, iron and rare earth metals. A piezoelectric component includes such a solder material. The solder material is applied by means of a base metallization.

Abstract: A multilayer piezo actuator is specified, in which piezoelectric layers and electrode layers are arranged to form a stack. Electrical contact is made with the electrode layers via two external electrodes which consist of wires which are woven with one another. The external electrodes are in this case connected over their entire area to the side surfaces of the stack. A method is also specified for fitting an external electrode.

Abstract: A component includes a component body and a contact-connection element composed of sheet metal having a contact region, which has an outer contour line and at least one hole. The contact region is arranged on a side of the component body having a side edge and the outer contour line has straight regions running along straight regions of the side edge. The straight regions of the outer contour line are connected by rounded corners.

Abstract: A resistance component includes a stack of ceramic layers and inner electrodes. Inner electrodes of a first type are electrically conductively connected to a first external contact and inner electrodes of a second type are electrically conductively connected to a second external contact. The inner electrodes of the first type are arranged such that there is no overlap with the inner electrodes of the second type. An inner electrode of a third type, which is electrically conductively connected neither to the first external contact nor to the second external contact, at least partially overlaps the inner electrodes of the first type and the inner electrodes of the second type.