Abstract: Attachment devices are described for attaching and locating overlapped anchor sheets while allowing for some relative movement as to expansion and contraction. Generally, the devices are a male/female connection on corresponding sheets and expansion openings or apertures surrounding either the male or female part to provide for areas of flexibility to provide for possible movement of either the male or female part.

Abstract: Attachment devices are described for attaching and locating overlapped anchor sheets while allowing for some relative movement as to expansion and contraction. Generally, the devices are a male/female connection on corresponding sheets and expansion openings or apertures surrounding either the male or female part to provide for areas of flexibility to provide for possible movement of either the male or female part.

Abstract: Attachment devices are described for attaching and locating overlapped anchor sheets while allowing for some relative movement as to expansion and contraction. Generally, the devices are a male/female connection on corresponding sheets and expansion openings or apertures surrounding either the male or female part to provide for areas of flexibility to provide for possible movement of either the male or female part.

Abstract: A system and method for manufacturing a substrate having a bed of hooks located therein, in particular a system or manufacturing a hook plate having hooks with enlarged shaped heads. The system can include the use of a heated generally flat coining plate, a resilient layer placed under the hook plate, and a forming sheet placed between the coining plate and the tops of stems to be coined.

Abstract: This invention relates to methods for manufacturing plates bonded to resilient layers, wherein the plate is made of a polypropylene and the resilient layer is made of a polyethylene. Ultrasonic welding used to bond the resilient layer to the plate. In some embodiments, a thin film is applied to a layer of the resilient layer before ultrasonic welding. While the film layer may be located adjacent the plate when welding, the film layer may also be advantageously located on the opposite of the resilient layer from the plate when welding. The film may also be applied to both sides of the resilient layer.

Abstract: A method for installing a first surface covering element onto a surface is provided. The element has one half of a hook and loop attachment system, and the surface has the other of the hook and loop attachment system. The method may include the steps of: (i) placing the first element onto the surface so that at least some of the respective hooks and loops of the first element and surface engage; and (ii) applying a force to the first element to encourage tensioning in the loops; and (iii) securing the first element into place.

Abstract: Attachment devices are described for attaching and locating overlapped anchor sheets while allowing for some relative movement as to expansion and contraction. Generally, the devices are a male/female connection on corresponding sheets and expansion openings or apertures surrounding either the male or female part to provide for areas of flexibility to provide for possible movement of either the male or female part.

Abstract: A system and method for manufacturing a substrate having a bed of hooks located therein, in particular a system or manufacturing a hook plate having hooks with enlarged shaped heads. The system can include the use of a heated generally flat coining plate, a resilient layer placed under the hook plate, and a forming sheet placed between the coining plate and the tops of stems to be coined.

Abstract: This invention relates to methods for manufacturing plates bonded to resilient layers, wherein the plate is made of a polypropylene and the resilient layer is made of a polyethylene. Ultrasonic welding used to bond the resilient layer to the plate. In some embodiments, a thin film is applied to a layer of the resilient layer before ultrasonic welding. While the film layer may be located adjacent the plate when welding, the film layer may also be advantageously located on the opposite of the resilient layer from the plate when welding. The film may also be applied to both sides of the resilient layer.