Patents by Inventor Franz Stückler

Franz Stückler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
    Publication number: 20120068345
    Abstract: In various embodiments, a layer stack is provided. The layer stack may include a carrier; a first metal disposed over the carrier; a second metal disposed over the first metal; and a solder material disposed above the second metal or a material that provides contact to a solder that is supplied by an external source. The second metal may have a melting temperature of at least 1800° C. and is not or substantially not dissolved in the solder material at least one of during a soldering process and after the soldering process.
    Type: Application
    Filed: September 16, 2010
    Publication date: March 22, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Tobias Schmidt, Evelyn Napetschnig, Franz Stueckler, Anton Pugatschow
  • Backside Processing of Semiconductor Devices
    Publication number: 20120007244
    Abstract: A semiconductor device includes a workpiece having a bottom surface opposite the top surface. Metallization layers are disposed over the top surface and a protective layer is disposed over the metallization layers. The semiconductor device further includes a metal silicide layer disposed on the bottom surface. The metal silicide layer is less than about five atomic layers in thickness. A first metal layer is disposed over the metal silicide layer such that a metal of the first metal layer is the same as a metal of the metal silicide layer.
    Type: Application
    Filed: July 9, 2010
    Publication date: January 12, 2012
    Inventors: Mark Harrison, Evelyn Napetschnig, Franz Stueckler