Abstract: A power electronics module for enhancing short circuit failure mode (SCFM) transitions. The module is adapted to disconnect a gate unit from the module using a first switch, upon a failure of at least one of a plurality of semiconductor chips during which the failed chip enters an SCFM, and connect a passive circuit arrangement, including at least one capacitor and at least one resistor, to the module using a second switch. The passive circuit arrangement is adapted to switch on at least one of the remaining non-failed semiconductor chips.

Abstract: A power electronics module for enhancing short circuit failure mode (SCFM) transitions. The module is adapted to disconnect a gate unit from the module using a first switch, upon a failure of at least one of a plurality of semiconductor chips during which the failed chip enters an SCFM, and connect a passive circuit arrangement, including at least one capacitor and at least one resistor, to the module using a second switch. The passive circuit arrangement is adapted to switch on at least one of the remaining non-failed semiconductor chips.

Abstract: A method for fabricating an electrical module comprising a first substrate plate (101), a second substrate plate (102), and semiconductor components (103-110) between the first and second substrate plates is presented. Also an electrical module obtainable with the method and an electrical converter device including such electrical modules are presented. In the method, a bond (112) between first sides of the semiconductor components and the first substrate plate is made by sintering and, subsequently, a bond (111) between second sides of the semiconductor components and the second substrate plate is made by soldering. As the sintered bond can withstand high temperatures, a high temperature solder can be used for the soldered bond without damaging the earlier made sintered bond.