Abstract: An increased number of fuses per area are provided in this semiconductor device while complying with the predetermined distance between the fuses. The device having a first patterned, conductive interconnect plane on a passivated substrate; a second patterned, conductive interconnect plane on the first patterned, conductive passivated interconnect plane; contact devices for selectively electrically contact-connecting the patterned, conductive interconnect planes to one another; a fuse device in a nonpassivated section of the second patterned, conductive interconnect plane with predetermined fuse regions for selectively linking interconnects; the fuse device being divided into fuse modules with fuse pairs and the fuse regions thereof at a predetermined distance from one another, which can be linked to a predetermined potential via a central interconnect.

Abstract: A plurality of digital-analog converters and analog-digital converters are connected in the data lines between the connection contacts and the memory cells of a memory device. The memory can be read, written to and actuated by analog data transfers instead of the previous digital signals. The same volume of data, for which a plurality of connection contact areas were normally required, can thus be read via just one connection contact. Addressing the memory cells requires no more than respective contact areas for the analog row address and the analog column address, which are converted into digital addresses using analog-digital converters.