Patents by Inventor Franziska Brem
Franziska Brem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10872830Abstract: A power semiconductor device includes a base plate; a Si chip including a Si substrate, the Si chip attached to the base plate; a first metal preform pressed with a first press pin against the Si chip; a wide bandgap material chip comprising a wide bandgap substrate and a semiconductor switch provided in the wide bandgap substrate, the wide bandgap material chip attached to the base plate; and a second metal preform pressed with a second press pin against the wide bandgap material chip; the Si chip and the wide bandgap material chip are connected in parallel via the base plate and via the first press pin and the second press pin; the first metal preform is adapted for forming a conducting path through the Si chip, when heated by an overcurrent; and the second metal preform is adapted for forming an temporary conducting path through the wide bandgap material chip or an open circuit, when heated by an overcurrent.Type: GrantFiled: August 1, 2019Date of Patent: December 22, 2020Assignee: ABB Schweiz AGInventors: Chunlei Liu, Juergen Schuderer, Franziska Brem, Munaf Rahimo, Peter Karl Steimer, Franc Dugal
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Patent number: 10797586Abstract: A power module included a plurality of normally-on semiconductor switches based on a wide bandgap substrate, the normally-on semiconductor switches connected in parallel; and a balancing unit including a capacitor and a balancing semiconductor switch connected in series, which are connected in parallel to the normally-on semiconductor switches.Type: GrantFiled: October 25, 2019Date of Patent: October 6, 2020Assignee: ABB Schweiz AGInventors: Uwe Drofenik, Francisco Canales, Chunlei Liu, Franziska Brem
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Patent number: 10673353Abstract: A converter cell for a modular converter includes at least one power semiconductor switch for switching a cell current through the converter cell; a cell capacitor interconnected with the at least one power semiconductor switch, such that the cell capacitor is loadable by the cell current; a controller for switching the at least one power semiconductor switch, wherein the controller is supplyable with auxiliary power from the cell capacitor; and a photovoltaic cell for providing initial and/or further auxiliary power to the controller.Type: GrantFiled: May 30, 2018Date of Patent: June 2, 2020Assignee: ABB Schweiz AGInventors: Uwe Drofenik, Franziska Brem, Francisco Canales
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Publication number: 20200059155Abstract: A power module included a plurality of normally-on semiconductor switches based on a wide bandgap substrate, the normally-on semiconductor switches connected in parallel; and a balancing unit including a capacitor and a balancing semiconductor switch connected in series, which are connected in parallel to the normally-on semiconductor switches.Type: ApplicationFiled: October 25, 2019Publication date: February 20, 2020Inventors: Uwe Drofenik, Francisco Canales, Chunlei Liu, Franziska Brem
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Publication number: 20190355634Abstract: A power semiconductor device includes a base plate; a Si chip including a Si substrate, the Si chip attached to the base plate; a first metal preform pressed with a first press pin against the Si chip; a wide bandgap material chip comprising a wide bandgap substrate and a semiconductor switch provided in the wide bandgap substrate, the wide bandgap material chip attached to the base plate; and a second metal preform pressed with a second press pin against the wide bandgap material chip; the Si chip and the wide bandgap material chip are connected in parallel via the base plate and via the first press pin and the second press pin; the first metal preform is adapted for forming a conducting path through the Si chip, when heated by an overcurrent; and the second metal preform is adapted for forming an temporary conducting path through the wide bandgap material chip or an open circuit, when heated by an overcurrent.Type: ApplicationFiled: August 1, 2019Publication date: November 21, 2019Inventors: Chunlei Liu, Juergen Schuderer, Franziska Brem, Munaf Rahimo, Peter Karl Steimer, Franc Dugal
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Publication number: 20180351474Abstract: A converter cell for a modular converter includes at least one power semiconductor switch for switching a cell current through the converter cell; a cell capacitor interconnected with the at least one power semiconductor switch, such that the cell capacitor is loadable by the cell current; a controller for switching the at least one power semiconductor switch, wherein the controller is supplyable with auxiliary power from the cell capacitor; and a photovoltaic cell for providing initial and/or further auxiliary power to the controller.Type: ApplicationFiled: May 30, 2018Publication date: December 6, 2018Inventors: Uwe Drofenik, Franziska Brem, Francisco Canales
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Publication number: 20160079156Abstract: The present disclosure describes a power electronics module comprising a lead frame in which a chip of a first semiconductor device is embedded, a first PCB mounted on top of the lead frame and the chip of the first semiconductor device, and a support frame mounted on top of the PCB, the support frame comprising a cavity in which the chip of a second semiconductor device is embedded, wherein the chips of the first semiconductor device and the second semiconductor device are positioned on top of each other, and the first PCB comprises a first electrically conducting path between the chips of the first semiconductor device and the second semiconductor device.Type: ApplicationFiled: August 17, 2015Publication date: March 17, 2016Inventors: Chunlei Liu, Didier Cottet, Franziska Brem, Slavo Kicin
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Patent number: 8791532Abstract: The sensor assembly comprises a substrate (1), such as a flexible printed circuit board, and a sensor chip (2) flip-chip mounted to the substrate (1), with a first side (3) of the sensor chip (2) facing the substrate (1). A sensing area (4) and contact pads (5) are integrated on the first side (3) of the sensor chip (2) and located in a chamber (17) between the substrate (1) and the sensor chip (2). Chamber (17) is bordered along at least two sides by a dam (16). Underfill (18) and/or solder flux is arranged between the sensor chip (2) and the substrate (1), and the dam (16) prevents the underfill from entering the chamber (17). An opening (19) extends from the chamber to the environment and is located between the substrate (1) and the sensor chip (2) or extends through the sensor chip (2).Type: GrantFiled: November 18, 2009Date of Patent: July 29, 2014Assignee: Sensirion AGInventors: Markus Graf, Werner Hunziker, Franziska Brem, Felix Mayer
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Patent number: 8736002Abstract: The sensor assembly comprises a substrate (1), such as a flexible printed circuit board, and a sensor chip (2) flip-chip mounted to the substrate (1), with a first side (3) of the sensor chip (2) facing the substrate (1). A sensing area (4) and contact pads (5) are integrated on the first side (3) of the sensor chip (2). Underfill (18) and/or solder flux is arranged between the sensor chip (2) and the substrate (1). The sensor chip (2) extends over an edge (12) of the substrate (1), with the edge (12) of the substrate (1) extending between the contact pads (5) and the sensing area (4) over the whole sensor chip (2). A dam (16) can be provided along the edge (12) of the substrate (1) for even better separation of the underfill (18) and the sensing area (4). This de sign allows for a simple alignment of the sensor chip on the substrate (1) and prevents underfill (18) from covering the sensing area (4).Type: GrantFiled: November 18, 2009Date of Patent: May 27, 2014Assignee: Sensirion AGInventors: Markus Graf, Werner Hunziker, Franziska Brem, Felix Mayer
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Publication number: 20120267731Abstract: The sensor assembly comprises a substrate (1), such as a flexible printed circuit board, and a sensor chip (2) flip-chip mounted to the substrate (1), with a first side (3) of the sensor chip (2) facing the substrate (1). A sensing area (4) and contact pads (5) are integrated on the first side (3) of the sensor chip (2) and located in a chamber (17) between the substrate (1) and the sensor chip (2). Chamber (17) is bordered along at least two sides by a dam (16). Underfill (18) and/or solder flux is arranged between the sensor chip (2) and the substrate (1), and the dam (16) prevents the underfill from entering the chamber (17). An opening (19) extends from the chamber to the environment and is located between the substrate (1) and the sensor chip (2) or extends through the sensor chip (2).Type: ApplicationFiled: November 18, 2009Publication date: October 25, 2012Inventors: Markus Graf, Werner Hunziker, Franziska Brem, Felix Mayer
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Publication number: 20120217593Abstract: The sensor assembly comprises a substrate (1), such as a flexible printed circuit board, and a sensor chip (2) flip-chip mounted to the substrate (1), with a first side (3) of the sensor chip (2) facing the substrate (1). A sensing area (4) and contact pads (5) are integrated on the first side (3) of the sensor chip (2). Underfill (18) and/or solder flux is arranged between the sensor chip (2) and the substrate (1). The sensor chip (2) extends over an edge (12) of the substrate (1), with the edge (12) of the substrate (1) extending between the contact pads (5) and the sensing area (4) over the whole sensor chip (2). A dam (16) can be provided along the edge (12) of the substrate (1) for even better separation of the underfill (18) and the sensing area (4). This de sign allows for a simple alignment of the sensor chip on the substrate (1) and prevents underfill (18) from covering the sensing area (4).Type: ApplicationFiled: November 18, 2009Publication date: August 30, 2012Inventors: Markus Graf, Werner Hunziker, Franziska Brem, Felix Mayer
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Patent number: 7901971Abstract: A method for packaging a sensor device having a sensitive structure integrated on a semiconductor chip is provided. When molding the device package, an inward extending section of the mold maintains an access opening to the sensor. A buffer layer is arranged on the chip between the inward extending section and the sensitive structure. The buffer layer protects the sensitive structure from damage by the inward extending section and acts as a seal while casting the housing. The buffer layer also covers at least part of the semiconductor electronic components of the circuitry integrated onto the chip. By covering these components, mechanical stress, as it is e.g. caused by different thermal expansion coefficients of the packaging and the chip, can be reduced.Type: GrantFiled: August 5, 2009Date of Patent: March 8, 2011Assignee: Sensirion AGInventors: Werner Hunziker, Franziska Brem, René Hummel
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Publication number: 20100117185Abstract: A temperature sensor with a bandgap circuit is provided. The bandgap circuit is covered by a buffer layer of photoresist. The device is packaged in a housing. By providing the buffer layer, mechanical stress in the bandgap circuit, as it is e.g. caused by different thermal expansion coefficients of the packaging and the chip, can be reduced. This improves the accuracy of the device.Type: ApplicationFiled: July 14, 2009Publication date: May 13, 2010Inventors: Werner Hunziker, Franziska Brem, René Hummel, Markus Graf
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Publication number: 20100035373Abstract: A method for packaging a sensor device having a sensitive structure integrated on a semiconductor chip is provided. When molding the device package, an inward extending section of the mold maintains an access opening to the sensor. A buffer layer is arranged on the chip between the inward extending section and the sensitive structure. The buffer layer protects the sensitive structure from damage by the inward extending section and acts as a seal while casting the housing. The buffer layer also covers at least part of the semiconductor electronic components of the circuitry integrated onto the chip. By covering these components, mechanical stress, as it is e.g. caused by different thermal expansion coefficients of the packaging and the chip, can be reduced.Type: ApplicationFiled: August 5, 2009Publication date: February 11, 2010Inventors: Werner Hunziker, Franziska Brem, Rene Hummel