Patents by Inventor Fred B. Hagedorn

Fred B. Hagedorn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonded structure of different materials which is substantially stress-free
    Patent number: 6315850
    Abstract: A process and apparatus for bonding together two layers of dissimilar material, yielding a composite structure which is substantially stress-free at a selectable reference temperature and reference isostatic pressure, which includes providing a first layer and a second layer; determining a critical line for the first layer and second layer in a pressure-temperature plane wherein a location of the critical line depends on the selectable reference temperature and reference isostatic pressure and depends on coefficients of thermal expansion and bulk moduli material constants of the first layer and the second layer, wherein the critical line sets forth a plurality of temperature-pressure pairs at which the composite structure will be substantially stress-free; controlling a temperature and an isostatic pressure during bonding such that the temperature and the isostatic pressure represent a point on the critical line; bonding the first layer and the second layer at the temperature and the isostatic pressure; and r
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: November 13, 2001
    Assignee: Northrop Grumman Corporation
    Inventors: Fred B. Hagedorn, William F. Cashion
  • Zero stress bonding of silicon carbide to diamond
    Patent number: 6189766
    Abstract: A multi-layer structure including a first layer; a second layer, with a coefficient of thermal expansion different than a coefficient of thermal expansion of the first layer, a bulk modulus different than a bulk modulus of the first layer and a thermal conductivity different than a thermal conductivity of the first layer; a bonding layer, having an isostatic pressure versus temperature curve with one of the first layer and the second layer which is substantially similar to an isostatic pressure versus temperature curve of the first layer and the second layer, such that a substantially stress-free bond is formed between the first layer and the second layer; wherein the first layer, the second layer, and the bonding layer are arranged as a sandwich, with the bonding layer in between the first layer and the second layer.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: February 20, 2001
    Assignee: Northrop Grumman Corporation
    Inventors: Martin L. Baker, William F. Cashion, Fred B. Hagedorn
  • Bonded structure of different materials which is substantially stress-free
    Patent number: 6077612
    Abstract: A process and apparatus for bonding together two layers of dissimilar material, yielding a composite structure which is substantially stress-free at a selectable reference temperature and reference isostatic pressure, which includes providing a first layer and a second layer; determining a critical line for the first layer and second layer in a pressure-temperature plane wherein a location of the critical line depends on the selectable reference temperature and reference isostatic pressure and depends on coefficients of thermal expansion and bulk moduli material constants of the first layer and the second layer, wherein the critical line sets forth a plurality of temperature-pressure pairs at which the composite structure will be substantially stress-free; controlling a temperature and an isostatic pressure during bonding such that the temperature and the isostatic pressure represent a point on the critical line; bonding the first layer and the second layer at the temperature and the isostatic pressure; and r
    Type: Grant
    Filed: November 21, 1997
    Date of Patent: June 20, 2000
    Assignee: Northrop Grumman Corporation
    Inventors: Fred B. Hagedorn, William F. Cashion
  • Stress-free bonding of dissimilar materials
    Patent number: 5769986
    Abstract: A process and apparatus for bonding together two layers of dissimilar material, yielding a composite structure which is substantially stress-free at a selectable reference temperature and reference isostatic pressure, which includes providing a first layer and a second layer; determining a critical line for the first layer and second layer in a pressure-temperature plane wherein a location of the critical line depends on the selectable reference temperature and reference isostatic pressure and depends on coefficients of thermal expansion and bulk moduli material constants of the first layer and the second layer, wherein the critical line sets forth a plurality of temperature-pressure pairs at which the composite structure will be substantially stress-free; controlling a temperature and an isostatic pressure during bonding such that the temperature and the isostatic pressure represent a point on the critical line; bonding the first layer and the second layer at the temperature and the isostatic pressure; and r
    Type: Grant
    Filed: August 13, 1996
    Date of Patent: June 23, 1998
    Assignee: Northrop Grumman Corporation
    Inventors: Fred B. Hagedorn, William F. Cashion