Patents by Inventor Fred E. Babian

Fred E. Babian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080304734
    Abstract: A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.
    Type: Application
    Filed: August 7, 2008
    Publication date: December 11, 2008
    Inventors: Scott A. Young, Roger Kroeze, Curt H. Chadwick, Nicholas Szabo, Kent E. Douglas, Fred E. Babian
  • Publication number: 20030063190
    Abstract: A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.
    Type: Application
    Filed: December 9, 2002
    Publication date: April 3, 2003
    Applicant: KLA INSTRUMENTS CORPORATION
    Inventors: Scott A. Young, Roger Kroeze, Curt H. Chadwick, Nicholas Szabo, Kent E. Douglas, Fred E. Babian
  • Publication number: 20020075385
    Abstract: A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.
    Type: Application
    Filed: January 31, 2002
    Publication date: June 20, 2002
    Applicant: KLA INSTRUMENTS CORPORATION
    Inventors: Scott A. Young, Roger Kroeze, Curt H. Chadwick, Nicholas Szabo, Kent E. Douglas, Fred E. Babian
  • Patent number: 6141038
    Abstract: A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, those electronic images are compared to detect any defects that may exist on one of the die.
    Type: Grant
    Filed: June 27, 1997
    Date of Patent: October 31, 2000
    Assignee: KLA Instruments Corporation
    Inventors: Scott A. Young, Roger Kroeze, Curt H. Chadwick, Nicholas Szabo, Kent E. Douglas, Fred E. Babian
  • Patent number: 4845558
    Abstract: A method of inspecting repeating pattern devices according to which an image of the patterns is aligned with an array of pixels in the image detection plane of an optical detector. The image is magnified to a scale so that features of patterns repeated in the image occupy corresponding pixels or groups of pixels repeated in the array. Data is resolved from selected pixels and directly compared either to data obtained from corresponding pixels or from a data base, whereby defective features are identified through well-known data comparison techniques.
    Type: Grant
    Filed: December 3, 1987
    Date of Patent: July 4, 1989
    Assignee: KLA Instruments Corporation
    Inventors: Bin-ming B. Tsai, Fred E. Babian