Abstract: A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact area (103), is located on the plate (101). This contact area (103) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon.

Abstract: A method and structure for controlling solder height of a surface mount device on a substrate uses electrical connection pads (105, 105') disposed onto a substrate (101). A height control pad (111) is also disposed onto the substrate (101) positioned apart from the electrical connection pads (105, 105'). Solder fillets (107, 107', 113) are disposed onto both the electrical connection pads (105, 105') and the height control pad (111). A component (103) having an electrical termination portion (109, 109') in contact with the solder fillets (107, 107') associated with the electrical connection pads (105, 105 ') and a body portion (115) in contact with the solder fillet (113) associated with the height control pad (111).

Abstract: An electronic control module (10) includes a package substrate (12) having an interior cavity (28) through which a package lead (22) traverses. The interior cavity (28) is filled with an expandable polymer material (34). The expandable polymer material (34) is constrained within the cavity by a pressure resistive layer (32, 35) that overlies expandable polymer material (34) In one embodiment, an epoxy layer (32) forms an upper surface of the interior cavity (28). The expandable polymer material (34) is responsive to a fluid, such that upon contact with a fluid diffusing along the package lead (22), the expandable polymer material (34) will swell and form a fluid-tight pressure seal around the package lead (22). The fluid-tight pressure seal prevents the fluid from diffusing to interior portions of the electronic control module (10) and causing the failure of electronic components (18) mounted within the electronic module (10).

Abstract: A component, preferably with a large mass like an electro-mechanical solenoid (101), includes a lead structure (109) to electrically terminate a winding (105) of the solenoid (101). The lead structure (109) is both rigid and flexible. The rigid portion of the lead structure includes an elongated first member (111 ) with a first inner end (113) connected to the winding (105) of the solenoid (101) and a first outer end (115). The flexible portion of the lead structure includes an elongated electrically conductive member (117) with a second inner end (119) connected to the winding (105) of the solenoid (101) and a second outer end (121). The second outer end (121) of the elongated electrically conductive member (117) is coupled to the first outer end (115) of the elongated first member (111). Preferably, the elongated electrically conductive member (117) has a cross-section smaller than a cross-section of the elongated first member (111).

Abstract: A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact area (103), is located on the plate (101). This contact area (103) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon.

Abstract: An electrical component/housing has a main body with a geometric central point and a lead frame having a plurality of leads formed of flat sheet stock. An intermediate flexible planar portion of each lead extends between emerging and end portions of each lead. The intermediate portion is orientated toward the central point so as to maximize absorption of thermal expansion stresses which are radially directed between the central point and the end lead portion which will be bonded to another structure.Also, a thermally stable connection arrangement comprising: a substrate having an electrical conductor thereon to which a component lead is connected at a third position, the substrate having a first coefficient of thermal expansion (a.sub.1); a heat sink base upon which the substrate is located at a first position, the base having a second predetermined coefficient of thermal expansion (a.sub.

Abstract: In a substrate mounting assembly (10) critical bonding pads (20) adjacent one lateral edge (21) of a ceramic substrate (11) are connected to semiconductor die (13) via wires (26). The substrate and die are mounted on a aluminum base carrier plate (12) which serves as a heat sink for the semiconductor die. A relatively rigid first adhesive (40) is applied in one area between the substrate and base carrier so as to effectively fix one lateral edge (21) of the substrate and the critical bonding pads (20) with respect to the base carrier, while a second adhesive (41), comprising an acrylic adhesive tape, bonds other areas of the ceramic substrate to the base carrier. At a lateral edge (23) of the substrate opposite to the lateral edge (21) adjacent the critical bonding pads, additional bonding pads (22) are provided and wires/conductors (27) connect these additional bonding pads to lead frame projections (28) from a non-conductive housing (29) fixed to the aluminum base carrier.