Patents by Inventor Fred Edelstein

Fred Edelstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5598888
    Abstract: A controlled low temperature chamber for a microscope has a vacuum chamber in a housing. The housing has a top panel and a bottom panel. A mounting in the chamber mounts a sample in a manner whereby the sample is microscopically observable. The mounting includes a base member, a pair of spaced supports extending perpendicularly from the base member and a pair of spaced platforms supported by the supports. Each of the platforms has an upper surface on which the sample rests and a spaced undersurface beneath the sample. A temperature control system maintains a specified temperature in the chamber, applies a controlled temperature gradient on the sample and moves the gradient along the sample in a controlled manner, thereby directionally solidifying and melting the sample, as desired.
    Type: Grant
    Filed: September 23, 1994
    Date of Patent: February 4, 1997
    Assignee: Grumman Aerospace Corporation
    Inventors: Edward V. Sullivan, Louis G. Casagrande, Fred Edelstein, John M. Papazian
  • Patent number: 5522455
    Abstract: A monogroove heat pipe has a single central manifold communicating with plural parallel connected evaporators and a single condenser. The invention is directed to a tubular screen device which is axially positioned within the liquid channel of the manifold. A number of longitudinally spaced holes are formed in the body of the screen device, each hole being defined by cusp edges which are turned outwardly from the screen body into joint ends of the condenser and evaporator liquid channels. The existence of the screen material at the joint between condenser, evaporators, and the manifold assists the establishment of a primed condition in the heat pipe, even in a zero "g" environment for any initial liquid distribution within the heat pipe.
    Type: Grant
    Filed: May 5, 1994
    Date of Patent: June 4, 1996
    Assignee: Northrop Grumman Corporation
    Inventors: Richard F. Brown, Bruce Cordes, Fred Edelstein, Robert L. Kosson
  • Patent number: 5303768
    Abstract: An improved capillary pumped loop evaporator includes circumferential grooves formed in the outer heat exchanger portion of the evaporator. The grooves open to the interface existing between the heat exchanger and a centrally positioned tubular wick. Axially extending vapor channels are formed in the wick and also open onto the interface. The circumferential grooves continuously communicate with the interface and provide a vapor escape to the vapor channels which direct vapor passage from the evaporator. By shortening the vapor path from the interface, a thinner vapor barrier is possible at the interface which results in more efficient heat transfer.
    Type: Grant
    Filed: February 17, 1993
    Date of Patent: April 19, 1994
    Assignee: Grumman Aerospace Corporation
    Inventors: Joseph P. Alario, Fred Edelstein, Robert L. Kosson, Maria Liandris
  • Patent number: 5219021
    Abstract: A re-entrant groove heat pipe provides capillary channel fin surfaces which are smooth, continuous, and offer a large radius of curvature upon which an extended thin film of working liquid may develop. Superior formation of thin films of the working fluid allows heat to be conducted more readily between the surface of the heat pipe and the surface of the fluid where evaporation and condensation takes place.
    Type: Grant
    Filed: October 17, 1991
    Date of Patent: June 15, 1993
    Assignee: Grumman Aerospace Corporation
    Inventors: Fred Edelstein, Robert L. Kosson
  • Patent number: 5209288
    Abstract: An interrupted monogroove slot in a heat pipe facilitates priming of the heat pipe under zero gravity conditions by preventing the monogroove slot from completely priming before the liquid channel is primed.
    Type: Grant
    Filed: October 10, 1991
    Date of Patent: May 11, 1993
    Assignee: Grumman Aerospace Corporation
    Inventors: Richard F. Brown, Fred Edelstein, Robert L. Kosson
  • Patent number: 4976754
    Abstract: An in-line, non-condensible gas trap for a liquid line which includes an interior mesh tube through which fluid can flow to a trap outlet. Non-condensible gas is trapped outwardly of the mesh tube due to capillary action and periodically the collected gas is vented thereby ridding the liquid line of the non-condensible gas. The present trap operates well in outer space environments (zero gravity) as well as normal ambient conditions (1 g).
    Type: Grant
    Filed: December 5, 1989
    Date of Patent: December 11, 1990
    Assignee: Grumman Aerospace Corporation
    Inventors: Fred Edelstein, Maria Liandris, Richard F. Brown
  • Patent number: 4917173
    Abstract: A liquid supply control is disclosed for a heat transfer system which transports heat by liquid-vapor phase change of a working fluid. An assembly (10) of monogroove heat pipe legs (15) can be operated automatically as either heat acquisition devices or heat discharge sources. The liquid channels (27) of the heat pipe legs (15) are connected to a reservoir (35) which is filled and drained by respective filling and draining valves (30, 32). Information from liquid level sensors (50, 51) on the reservoir (35) is combined (60) with temperature information (55) from the liquid heat exchanger (12) and temperature information (56) from the assembly vapor conduit (42) to regulate filling and draining of the reservoir (35), so that the reservoir (35) in turn serves the liquid supply/drain needs of the heat pipe legs (15), on demand, by passive capillary action (20, 28).
    Type: Grant
    Filed: November 15, 1988
    Date of Patent: April 17, 1990
    Assignee: The United States of America as represented by the National Aeronautics and Space Administration
    Inventors: Richard F. Brown, Fred Edelstein
  • Patent number: 4750543
    Abstract: A pumped loop two-phase heat transfer system, operating at a nearly constant temperature throughout, includes a plurality of independently operating grooved capillary heat exchanger plates supplied with working fluid through independent flow modulation valves connected to a liquid supply line, a vapor line for collecting vapor from the heat exchangers, a condenser between the vapor and the liquid lines, and a fluid circulating pump between the condenser and the heat exchangers.
    Type: Grant
    Filed: April 1, 1987
    Date of Patent: June 14, 1988
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Fred Edelstein
  • Patent number: 4687048
    Abstract: The coolant fluid evaporated in a compact heat absorbing panel (12) utilizing monogroove heat pipes in a pumped two-phase system is replenished through a liquid inlet control valve (35) under the control of an ultrasonic liquid presence detector (40) which is connected to the panel (10). The detector (40) maintains the desired liquid quantity in the panel's liquid coolant channels (25), thereby dynamically responding to varying heat loads.
    Type: Grant
    Filed: June 18, 1986
    Date of Patent: August 18, 1987
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Fred Edelstein, Richard F. Brown
  • Patent number: 4685512
    Abstract: A thermal management system using heat pipe principles and incorporating capillary-pumped equipment mounting panels such that a heat transport loop without moving parts is provided. The panels can function to either absorb heat or to reject heat and can interface with heat generating equipment or heat radiators. Each panel comprises a pair of coextensive flat plates bonded together with a thin, fine-pore sheet wick interposed therebetween. A network of liquid grooves in one plate is in fluid communication with the sheet wick which covers the grooves and most of the plate and a separate liquid line connecting the panels. A network of vapor channels in the other plate is in fluid communication with the wick and with a separate vapor line connecting the panels. The vapor channel networks of the panels and the liquid groove networks of the panels are connected such that the panels are arranged in parallel in the fluid circuit or loop.
    Type: Grant
    Filed: July 24, 1986
    Date of Patent: August 11, 1987
    Assignee: Grumman Aerospace Corporation
    Inventors: Fred Edelstein, Robert A. Haslett, Robert L. Kosson, William Harwell
  • Patent number: 4664177
    Abstract: A pumped loop two-phase heat transfer system, operating at a nearly constant temperature throughout, includes a plurality of independently operating grooved capillary heat exchanger plates supplied with working fluid through independent flow modulation valves connected to a liquid supply line, a vapor line for collecting vapor from the heat exchangers, a condenser between the vapor and the liquid lines, and a fluid circulating pump between the condenser and the heat exchangers.
    Type: Grant
    Filed: July 15, 1985
    Date of Patent: May 12, 1987
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Fred Edelstein
  • Patent number: 4602679
    Abstract: A thermal management system using heat pipe principles and incorporating capillary-pumped equipment mounting panels such that a heat transport loop without moving parts is provided. The panels can function to either absorb heat or to reject heat and can interface with heat generating equipment or heat radiators. Each panel comprises a pair of coextensive flat plates bonded together with a thin, fine-pore sheet wick interposed therebetween. A network of liquid grooves in one plate is in fluid communication with the sheet wick which covers the grooves and most of the plate and a separate liquid line connecting the panels. A network of vapor channels in the other plate is in fluid communication with the wick and with a separate vapor line connecting the panels. The vapor channel networks of the panels and the liquid groove networks of the panels are connected such that the panels are arranged in parallel in the fluid circuit or loop.
    Type: Grant
    Filed: March 22, 1982
    Date of Patent: July 29, 1986
    Assignee: Grumman Aerospace Corporation
    Inventors: Fred Edelstein, Robert A. Haslett, Robert L. Kosson, William Harwell
  • Patent number: 4366526
    Abstract: A circuit card having the capability for the high-density packaging of electronic components thereon for use in high power-density card racks in computer and other electronic and avionic systems. The card has an all metal construction with an elongated planar body portion for the mounting of electronic components on the opposite sides thereof and has a heat pipe located along the edges of one elongated side and the two ends. A connector for making the required electrical connections to the electronic components is provided along the edge of the second elongated side. Edge tabs on the ends of the card permit the card to be installed into a card rack in electronic equipment. The elongated portion of the heat pipe serves as the evaporator region thereof and the two end portions act as the condensing regions.
    Type: Grant
    Filed: October 3, 1980
    Date of Patent: December 28, 1982
    Assignee: Grumman Aerospace Corporation
    Inventors: Bruno Lijoi, Vincent Cirrito, Fred Edelstein
  • Patent number: 4081023
    Abstract: A heat pipe to remove heat from a light fixture in a room of a building that will transfer the fixture heat to a system in a building that will in turn reject or use the fixture heat in a heating, ventilating, air conditioning system for the building.
    Type: Grant
    Filed: November 26, 1976
    Date of Patent: March 28, 1978
    Assignee: Grumman Aerospace Corporation
    Inventors: Fred Edelstein, Robert A. Haslett, Odd E. Sangesland