Abstract: A combined battery charger and motor driver circuit assembly includes a rechargeable battery, a traction motor configured to accept a pulse-width-modulated (PWM) drive, a PNP transistor array, a charging source of chopped and rectified DC, and a control circuit configured to apply a discrete PWM drive signal to the gate of each transistor in the PNP transistor array.

Abstract: A combined battery charger and motor driver circuit assembly includes a rechargeable battery, a traction motor configured to accept a pulse-width-modulated (PWM) drive, a PNP transistor array, a charging source of chopped and rectified DC, and a control circuit configured to apply a discrete PWM drive signal to the gate of each transistor in the PNP transistor array.

Abstract: A combined battery charger and motor driver circuit assembly includes a rechargeable battery, a traction motor configured to accept a pulse-width-modulated (PWM) drive, a PNP transistor array, a charging source of chopped and rectified DC, and a control circuit configured to apply a discrete PWM drive signal to the gate of each transistor in the PNP transistor array.

Abstract: A circuit and method to provide dynamic fault protection to transistors are disclosed. The fault protection may be particularly suited for protecting insulated gate bipolar transistors (IGBTs).

Abstract: An insulated gate bipolar transistor includes bump pad connectors to provide thermal contact with a heat spreader for dissipating heat away form the insulated gate bipolar transistor.

Abstract: A method for determining power semiconductor operating temperatures uses a database of measured temperatures. Each temperature is associated with operating conditions and determined by laboratory testing in an environment indicative of operation of the power semiconductors actual operations.

Abstract: Power converter system topologies comprise a DC/DC converter. The DC/DC converter includes a transformer coupling a high side to a low side. The high side may include an inverter bridge in the form of an inverter module and an inductor. The low side may include a rectifier in the form of a rectifier module and a pair of inductors. The transformer may take the form of a planar transformer.

Abstract: A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

Abstract: A tri-level inverter power module has an architecture employing a high degree of modularity that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.

Abstract: A circuit and method to provide dynamic fault protection to transistors are disclosed. The fault protection may be particularly suited for protecting insulated gate bipolar transistors (IGBTs).

Abstract: A method for determining power semiconductor operating temperatures uses a database of measured temperatures. Each temperature is associated with operating conditions and determined by laboratory testing in an environment indicative of operation of the power semiconductors actual operations.

Abstract: An insulated gate bipolar transistor includes bump pad connectors to provide thermal contact with a heat spreader for dissipating heat away form the insulated gate bipolar transistor.

Abstract: A power converter utilizes a high frequency capacitor and a bulk capacitor coupled across the DC terminals to reduce high frequency effect and voltage overshoot, leading to space and cost savings in power converter design. Each capacitor may be physically coupled adjacent the gate driver board via clips, clamps, and/or fasteners.

Abstract: Power converter system topologies comprise a DC/DC converter. The DC/DC converter includes a transformer coupling a high side to a low side. The high side may include an inverter bridge in the form of an inverter module and an inductor. The low side may include a rectifier in the form of a rectifier module and a pair of inductors. The transformer may take the form of a planar transformer.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

Abstract: A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

Abstract: A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.