Patents by Inventor Fred G. Benkley
Fred G. Benkley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180276519Abstract: Devices, systems, and methods facilitate enrollment of authenticating biometric data for authenticating an authorized user via a biometric sensor. Included devices transmit power to a sensor-enabled device that does not have an independent power source without transmitting data to or from the device. Data input devices coupled to the biometric sensor enable user input of non-biometric data, such as an activation code, via the biometric sensor. For biometric sensors comprising fingerprint sensors, finger guides position a finger to contact the sensor at a desired orientation. Systems and methods allow for enrollment of one or more authenticating biometric data templates with or without requiring input of non-biometric authentication data, such as an activation code.Type: ApplicationFiled: March 22, 2018Publication date: September 27, 2018Applicant: IDEX ASAInventors: Fred G. BENKLEY, III, Peter Joseph COMMERFORD, Jeffrey Joseph BUXTON, Anne L. MCALEER
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Publication number: 20180276518Abstract: Devices, systems, and methods facilitate enrollment of authenticating biometric data for authenticating an authorized user via a biometric sensor. Included devices transmit power to a sensor-enabled device that does not have an independent power source without transmitting data to or from the device. Data input devices coupled to the biometric sensor enable user input of non-biometric data, such as an activation code, via the biometric sensor. For biometric sensors comprising fingerprint sensors, finger guides position a finger to contact the sensor at a desired orientation. Systems and methods allow for enrollment of one or more authenticating biometric data templates with or without requiring input of non-biometric authentication data, such as an activation code.Type: ApplicationFiled: March 14, 2018Publication date: September 27, 2018Applicant: IDEX ASAInventors: Fred G. BENKLEY, III, Peter Joseph COMMERFORD, Jeffrey Joseph BUXTON, Anne L. MCALEER
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Patent number: 10078775Abstract: A sensor has parallel upper pickup lines in an upper conductive layer, parallel lower pickup lines in a lower conductive layer, parallel drive lines oriented transversely to the upper and lower pickup lines in a middle conductive layer, a first insulating layer separating the upper pickup lines from the drive lines, and a second insulating layer opposite the first insulating layer and separating the lower pickup lines from the drive lines. Upper electrode pairs are defined at locations where an upper pickup electrode crosses a drive line, and each upper electrode pair has an impedance that is sensitive to a first object contacting or in close proximity to the upper electrode pair. Lower electrode pairs are defined at locations where a lower pickup line crosses a drive line, and each lower electrode pair has an impedance that is sensitive to a second object contacting or in close proximity to the lower electrode pair.Type: GrantFiled: June 22, 2016Date of Patent: September 18, 2018Assignee: IDEX ASAInventor: Fred G. Benkley, III
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Publication number: 20180232554Abstract: A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.Type: ApplicationFiled: April 5, 2018Publication date: August 16, 2018Applicant: IDEX ASAInventors: Fred G. Benkley, III, David N. Light, David Rodney Baker, Thomas Gaudette
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Publication number: 20180213646Abstract: A fingerprint sensor module includes a fingerprint sensor assembly with a circuit element attached. The fingerprint sensor assembly is electrically connected to a printed circuit board (PCB) substrate with a cutout to accommodate the circuit element. The entire fingerprint sensor assembly and at least part of the PCB are encapsulated in a encapsulating material to produce a structurally robust fingerprint sensor module suitable for integration into an electronics device such as a smartphone or other “Internet of Things” (IOT) electronic device.Type: ApplicationFiled: January 24, 2018Publication date: July 26, 2018Applicant: IDEX ASAInventors: Fred G. BENKLEY, III, David N. Light, David Joseph Geoffroy, Massimo Eugenio Ravelli
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Publication number: 20180068159Abstract: A method of securing a fingerprint sensor into a host device panel comprises, in one embodiment, securing a cover panel to the fingerprint sensor assembly and then securing the covered fingerprint sensor into a hole formed in the host device panel. In another embodiment, the cover panel is secured within a hole formed in the host device panel, and then the host device panel is placed over the fingerprint sensor assembly with the cover member aligned with the sensor assembly.Type: ApplicationFiled: September 1, 2017Publication date: March 8, 2018Applicant: IDEX ASAInventors: FRED G. BENKLEY, III, DAVID JOSEPH GEOFFROY, DAVID N. LIGHT
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Publication number: 20180046841Abstract: A sensor has drive lines and transverse pickup lines to define an electrode pair where each pickup line crosses a drive line. A reference pickup line is arranged parallel to the pickup lines and a compensation drive line is arranged parallel to the drive lines. A signal source provides a first signal to the drive lines and a second signal that is the inverse of the first signal to the compensation drive line. An amplifier has a first input connected to a pickup line, a second input connected to a reference pickup line, and a output indicative of an object in contact with the electrode pair(s). Each impedance between the compensation drive line and a pickup line, between the reference pickup line and a reference drive line, and between the compensation drive line and the reference pickup line is equal to the impedance at the electrode pair when no object is contact with the electrode pair.Type: ApplicationFiled: October 2, 2017Publication date: February 15, 2018Applicant: IDEX ASAInventor: Fred G. BENKLEY, III
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Publication number: 20170330016Abstract: A sensor has drive lines and transverse pickup lines to define an electrode pair where each pickup line crosses a drive line. A reference pickup line is arranged parallel to the pickup lines and a compensation drive line is arranged parallel to the drive lines. A signal source provides a first signal to the drive lines and a second signal that is the inverse of the first signal to the compensation drive line. An amplifier has a first input connected to a pickup line, a second input connected to a reference pickup line, and a output indicative of an object in contact with the electrode pair(s). Each impedance between the compensation drive line and a pickup line, between the reference pickup line and a reference drive line, and between the compensation drive line and the reference pickup line is equal to the impedance at the electrode pair when no object is contact with the electrode pair.Type: ApplicationFiled: August 3, 2017Publication date: November 16, 2017Applicant: IDEX ASAInventor: Fred G. BENKLEY, III
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Publication number: 20170308228Abstract: A display is integrated with a touch screen and a fingerprint sensor having a plurality of substantially parallel drive lines configured to transmit a signal into a surface of a proximally located object and a plurality of substantially parallel pickup lines oriented proximate the drive lines and electrically separated from the pickup lines to form intrinsic electrode pairs that are impedance sensitive at each of the drive and pickup proximal locations. The display may comprise an OLED display with an OLED injector layer and an OLED emissive layer disposed between the drive lines and pickup lines.Type: ApplicationFiled: May 9, 2017Publication date: October 26, 2017Applicant: IDEX ASAInventors: Fred G. BENKLEY, III, David Joseph GEOFFROY
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Patent number: 9798917Abstract: An novel sensor is provided having a plurality of substantially parallel drive lines configured to transmit a signal into a surface of a proximally located object, and also a plurality of substantially parallel pickup lines oriented proximate the drive lines and electrically separated from the pickup lines to form intrinsic electrode pairs that are impedance sensitive at each of the drive and pickup proximal locations.Type: GrantFiled: November 21, 2016Date of Patent: October 24, 2017Assignee: IDEX ASAInventors: Fred G. Benkley, III, David Joseph Geoffroy
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Patent number: 9779280Abstract: A sensor has drive lines and transverse pickup lines to define an electrode pair where each pickup line crosses a drive line. A reference pickup line is arranged parallel to the pickup lines and a compensation drive line is arranged parallel to the drive lines. A signal source provides a first signal to the drive lines and a second signal that is the inverse of the first signal to the compensation drive line. An amplifier has a first input connected to a pickup line, a second input connected to a reference pickup line, and a output indicative of an object in contact with the electrode pair(s). Each impedance between the compensation drive line and a pickup line, between the reference pickup line and a reference drive line, and between the compensation drive line and the reference pickup line is equal to the impedance at the electrode pair when no object is contact with the electrode pair.Type: GrantFiled: December 24, 2014Date of Patent: October 3, 2017Assignee: IDEX ASAInventor: Fred G. Benkley, III
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Publication number: 20170228574Abstract: A novel sensor is provided having a plurality of substantially parallel drive lines configured to transmit a signal into a surface of a proximally located object and also a plurality of substantially parallel pickup lines oriented proximate the drive lines and electrically separated from the drive lines to form intrinsic electrode pairs that are impedance sensitive at each of the drive and pickup proximal locations. A switch is integrated with the sensor.Type: ApplicationFiled: April 25, 2017Publication date: August 10, 2017Applicant: IDEX ASAInventor: FRED G. BENKLEY, III
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Publication number: 20170154200Abstract: A fingerprint sensing module includes a sensor substrate having a sensing side and a circuit side, an image sensor including conductive traces on the circuit side of the sensor substrate, and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor. The sensor substrate may be a flexible substrate. The module may include a velocity sensor on the sensor substrate or on a separate substrate. The module may further include a rigid substrate, and the sensor substrate may be affixed to the rigid substrate.Type: ApplicationFiled: February 13, 2017Publication date: June 1, 2017Inventor: Fred G. Benkley, III
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Publication number: 20170147852Abstract: A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.Type: ApplicationFiled: November 17, 2016Publication date: May 25, 2017Applicant: IDEX ASAInventors: FRED G. BENKLEY, III, DAVID N. LIGHT, DAVID RODNEY BAKER, THOMAS GAUDETTE
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Patent number: 9659208Abstract: An novel sensor is provided having a plurality of substantially parallel drive lines configured to transmit a signal into a surface of a proximally located object, and also a plurality of substantially parallel pickup lines oriented proximate the drive lines and electrically separated from the pickup lines to form intrinsic electrode pairs that are impedance sensitive at each of the drive and pickup proximal locations.Type: GrantFiled: November 19, 2015Date of Patent: May 23, 2017Assignee: IDEX ASAInventor: Fred G. Benkley, III
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Patent number: 9600704Abstract: An novel impedance sensor is provided having a plurality of substantially parallel drive lines configured to transmit a signal into a surface of a proximally located object, and also a plurality of substantially parallel pickup lines oriented substantially perpendicular to the drive lines and separated from the pickup lines by a dielectric to form intrinsic electrode pairs that are impedance sensitive at each of the drive and pickup crossover locations.Type: GrantFiled: March 13, 2013Date of Patent: March 21, 2017Assignee: IDEX ASAInventor: Fred G. Benkley, III
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Patent number: 9569654Abstract: A sensing module, such as a fingerprint sensing module, is disclosed. The sensing module includes a rigid substrate having a cutout, a flexible substrate attached to the rigid substrate, an image sensor including conductive traces formed on the flexible substrate, and a sensor integrated circuit that is connected to the conductive traces of the image sensor. The sensor integrated circuit is disposed in the cutout of the rigid substrate. The sensor integrated circuit can be fully enclosed in the cutout or disposed between the flexible substrate and the rigid substrate. The flexible substrate can also have a sensing side and a circuit side, where the conductive traces are formed on the circuit side and a finger is configured to be received from the sensing side. The conductive traces on the flexible substrate can also form a plurality of sensor gaps between respective image drive plates and image pickup plates.Type: GrantFiled: November 2, 2015Date of Patent: February 14, 2017Assignee: Synaptics IncorporatedInventor: Fred G. Benkley, III
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Publication number: 20160379035Abstract: A sensor has parallel upper pickup lines in an upper conductive layer, parallel lower pickup lines in a lower conductive layer, parallel drive lines oriented transversely to the upper and lower pickup lines in a middle conductive layer, a first insulating layer separating the upper pickup lines from the drive lines, and a second insulating layer opposite the first insulating layer and separating the lower pickup lines from the drive lines. Upper electrode pairs are defined at locations where an upper pickup electrode crosses a drive line, and each upper electrode pair has an impedance that is sensitive to a first object contacting or in close proximity to the upper electrode pair. Lower electrode pairs are defined at locations where a lower pickup line crosses a drive line, and each lower electrode pair has an impedance that is sensitive to a second object contacting or in close proximity to the lower electrode pair.Type: ApplicationFiled: June 22, 2016Publication date: December 29, 2016Applicant: IDEX ASAInventor: FRED G. BENKLEY, III
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Publication number: 20160188951Abstract: A sensor has drive lines and transverse pickup lines to define an electrode pair where each pickup line crosses a drive line. A reference pickup line is arranged parallel to the pickup lines and a compensation drive line is arranged parallel to the drive lines. A signal source provides a first signal to the drive lines and a second signal that is the inverse of the first signal to the compensation drive line. An amplifier has a first input connected to a pickup line, a second input connected to a reference pickup line, and a output indicative of an object in contact with the electrode pair(s). Each impedance between the compensation drive line and a pickup line, between the reference pickup line and a reference drive line, and between the compensation drive line and the reference pickup line is equal to the impedance at the electrode pair when no object is contact with the electrode pair.Type: ApplicationFiled: December 24, 2014Publication date: June 30, 2016Applicant: IDEX ASAInventor: Fred G. BENKLEY, III
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Publication number: 20160154988Abstract: An novel sensor is provided having a plurality of substantially parallel drive lines configured to transmit a signal into a surface of a proximally located object, and also a plurality of substantially parallel pickup lines oriented proximate the drive lines and electrically separated from the pickup lines to form intrinsic electrode pairs that are impedance sensitive at each of the drive and pickup proximal locations.Type: ApplicationFiled: November 19, 2015Publication date: June 2, 2016Applicant: IDEX ASAInventor: FRED G. BENKLEY, III