Patents by Inventor Fred G. Benkley

Fred G. Benkley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180276519
    Abstract: Devices, systems, and methods facilitate enrollment of authenticating biometric data for authenticating an authorized user via a biometric sensor. Included devices transmit power to a sensor-enabled device that does not have an independent power source without transmitting data to or from the device. Data input devices coupled to the biometric sensor enable user input of non-biometric data, such as an activation code, via the biometric sensor. For biometric sensors comprising fingerprint sensors, finger guides position a finger to contact the sensor at a desired orientation. Systems and methods allow for enrollment of one or more authenticating biometric data templates with or without requiring input of non-biometric authentication data, such as an activation code.
    Type: Application
    Filed: March 22, 2018
    Publication date: September 27, 2018
    Applicant: IDEX ASA
    Inventors: Fred G. BENKLEY, III, Peter Joseph COMMERFORD, Jeffrey Joseph BUXTON, Anne L. MCALEER
  • Publication number: 20180276518
    Abstract: Devices, systems, and methods facilitate enrollment of authenticating biometric data for authenticating an authorized user via a biometric sensor. Included devices transmit power to a sensor-enabled device that does not have an independent power source without transmitting data to or from the device. Data input devices coupled to the biometric sensor enable user input of non-biometric data, such as an activation code, via the biometric sensor. For biometric sensors comprising fingerprint sensors, finger guides position a finger to contact the sensor at a desired orientation. Systems and methods allow for enrollment of one or more authenticating biometric data templates with or without requiring input of non-biometric authentication data, such as an activation code.
    Type: Application
    Filed: March 14, 2018
    Publication date: September 27, 2018
    Applicant: IDEX ASA
    Inventors: Fred G. BENKLEY, III, Peter Joseph COMMERFORD, Jeffrey Joseph BUXTON, Anne L. MCALEER
  • Patent number: 10078775
    Abstract: A sensor has parallel upper pickup lines in an upper conductive layer, parallel lower pickup lines in a lower conductive layer, parallel drive lines oriented transversely to the upper and lower pickup lines in a middle conductive layer, a first insulating layer separating the upper pickup lines from the drive lines, and a second insulating layer opposite the first insulating layer and separating the lower pickup lines from the drive lines. Upper electrode pairs are defined at locations where an upper pickup electrode crosses a drive line, and each upper electrode pair has an impedance that is sensitive to a first object contacting or in close proximity to the upper electrode pair. Lower electrode pairs are defined at locations where a lower pickup line crosses a drive line, and each lower electrode pair has an impedance that is sensitive to a second object contacting or in close proximity to the lower electrode pair.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: September 18, 2018
    Assignee: IDEX ASA
    Inventor: Fred G. Benkley, III
  • Publication number: 20180232554
    Abstract: A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.
    Type: Application
    Filed: April 5, 2018
    Publication date: August 16, 2018
    Applicant: IDEX ASA
    Inventors: Fred G. Benkley, III, David N. Light, David Rodney Baker, Thomas Gaudette
  • Publication number: 20180213646
    Abstract: A fingerprint sensor module includes a fingerprint sensor assembly with a circuit element attached. The fingerprint sensor assembly is electrically connected to a printed circuit board (PCB) substrate with a cutout to accommodate the circuit element. The entire fingerprint sensor assembly and at least part of the PCB are encapsulated in a encapsulating material to produce a structurally robust fingerprint sensor module suitable for integration into an electronics device such as a smartphone or other “Internet of Things” (IOT) electronic device.
    Type: Application
    Filed: January 24, 2018
    Publication date: July 26, 2018
    Applicant: IDEX ASA
    Inventors: Fred G. BENKLEY, III, David N. Light, David Joseph Geoffroy, Massimo Eugenio Ravelli
  • Publication number: 20180068159
    Abstract: A method of securing a fingerprint sensor into a host device panel comprises, in one embodiment, securing a cover panel to the fingerprint sensor assembly and then securing the covered fingerprint sensor into a hole formed in the host device panel. In another embodiment, the cover panel is secured within a hole formed in the host device panel, and then the host device panel is placed over the fingerprint sensor assembly with the cover member aligned with the sensor assembly.
    Type: Application
    Filed: September 1, 2017
    Publication date: March 8, 2018
    Applicant: IDEX ASA
    Inventors: FRED G. BENKLEY, III, DAVID JOSEPH GEOFFROY, DAVID N. LIGHT
  • Publication number: 20180046841
    Abstract: A sensor has drive lines and transverse pickup lines to define an electrode pair where each pickup line crosses a drive line. A reference pickup line is arranged parallel to the pickup lines and a compensation drive line is arranged parallel to the drive lines. A signal source provides a first signal to the drive lines and a second signal that is the inverse of the first signal to the compensation drive line. An amplifier has a first input connected to a pickup line, a second input connected to a reference pickup line, and a output indicative of an object in contact with the electrode pair(s). Each impedance between the compensation drive line and a pickup line, between the reference pickup line and a reference drive line, and between the compensation drive line and the reference pickup line is equal to the impedance at the electrode pair when no object is contact with the electrode pair.
    Type: Application
    Filed: October 2, 2017
    Publication date: February 15, 2018
    Applicant: IDEX ASA
    Inventor: Fred G. BENKLEY, III
  • Publication number: 20170330016
    Abstract: A sensor has drive lines and transverse pickup lines to define an electrode pair where each pickup line crosses a drive line. A reference pickup line is arranged parallel to the pickup lines and a compensation drive line is arranged parallel to the drive lines. A signal source provides a first signal to the drive lines and a second signal that is the inverse of the first signal to the compensation drive line. An amplifier has a first input connected to a pickup line, a second input connected to a reference pickup line, and a output indicative of an object in contact with the electrode pair(s). Each impedance between the compensation drive line and a pickup line, between the reference pickup line and a reference drive line, and between the compensation drive line and the reference pickup line is equal to the impedance at the electrode pair when no object is contact with the electrode pair.
    Type: Application
    Filed: August 3, 2017
    Publication date: November 16, 2017
    Applicant: IDEX ASA
    Inventor: Fred G. BENKLEY, III
  • Publication number: 20170308228
    Abstract: A display is integrated with a touch screen and a fingerprint sensor having a plurality of substantially parallel drive lines configured to transmit a signal into a surface of a proximally located object and a plurality of substantially parallel pickup lines oriented proximate the drive lines and electrically separated from the pickup lines to form intrinsic electrode pairs that are impedance sensitive at each of the drive and pickup proximal locations. The display may comprise an OLED display with an OLED injector layer and an OLED emissive layer disposed between the drive lines and pickup lines.
    Type: Application
    Filed: May 9, 2017
    Publication date: October 26, 2017
    Applicant: IDEX ASA
    Inventors: Fred G. BENKLEY, III, David Joseph GEOFFROY
  • Patent number: 9798917
    Abstract: An novel sensor is provided having a plurality of substantially parallel drive lines configured to transmit a signal into a surface of a proximally located object, and also a plurality of substantially parallel pickup lines oriented proximate the drive lines and electrically separated from the pickup lines to form intrinsic electrode pairs that are impedance sensitive at each of the drive and pickup proximal locations.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: October 24, 2017
    Assignee: IDEX ASA
    Inventors: Fred G. Benkley, III, David Joseph Geoffroy
  • Patent number: 9779280
    Abstract: A sensor has drive lines and transverse pickup lines to define an electrode pair where each pickup line crosses a drive line. A reference pickup line is arranged parallel to the pickup lines and a compensation drive line is arranged parallel to the drive lines. A signal source provides a first signal to the drive lines and a second signal that is the inverse of the first signal to the compensation drive line. An amplifier has a first input connected to a pickup line, a second input connected to a reference pickup line, and a output indicative of an object in contact with the electrode pair(s). Each impedance between the compensation drive line and a pickup line, between the reference pickup line and a reference drive line, and between the compensation drive line and the reference pickup line is equal to the impedance at the electrode pair when no object is contact with the electrode pair.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: October 3, 2017
    Assignee: IDEX ASA
    Inventor: Fred G. Benkley, III
  • Publication number: 20170228574
    Abstract: A novel sensor is provided having a plurality of substantially parallel drive lines configured to transmit a signal into a surface of a proximally located object and also a plurality of substantially parallel pickup lines oriented proximate the drive lines and electrically separated from the drive lines to form intrinsic electrode pairs that are impedance sensitive at each of the drive and pickup proximal locations. A switch is integrated with the sensor.
    Type: Application
    Filed: April 25, 2017
    Publication date: August 10, 2017
    Applicant: IDEX ASA
    Inventor: FRED G. BENKLEY, III
  • Publication number: 20170154200
    Abstract: A fingerprint sensing module includes a sensor substrate having a sensing side and a circuit side, an image sensor including conductive traces on the circuit side of the sensor substrate, and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor. The sensor substrate may be a flexible substrate. The module may include a velocity sensor on the sensor substrate or on a separate substrate. The module may further include a rigid substrate, and the sensor substrate may be affixed to the rigid substrate.
    Type: Application
    Filed: February 13, 2017
    Publication date: June 1, 2017
    Inventor: Fred G. Benkley, III
  • Publication number: 20170147852
    Abstract: A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.
    Type: Application
    Filed: November 17, 2016
    Publication date: May 25, 2017
    Applicant: IDEX ASA
    Inventors: FRED G. BENKLEY, III, DAVID N. LIGHT, DAVID RODNEY BAKER, THOMAS GAUDETTE
  • Patent number: 9659208
    Abstract: An novel sensor is provided having a plurality of substantially parallel drive lines configured to transmit a signal into a surface of a proximally located object, and also a plurality of substantially parallel pickup lines oriented proximate the drive lines and electrically separated from the pickup lines to form intrinsic electrode pairs that are impedance sensitive at each of the drive and pickup proximal locations.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: May 23, 2017
    Assignee: IDEX ASA
    Inventor: Fred G. Benkley, III
  • Patent number: 9600704
    Abstract: An novel impedance sensor is provided having a plurality of substantially parallel drive lines configured to transmit a signal into a surface of a proximally located object, and also a plurality of substantially parallel pickup lines oriented substantially perpendicular to the drive lines and separated from the pickup lines by a dielectric to form intrinsic electrode pairs that are impedance sensitive at each of the drive and pickup crossover locations.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: March 21, 2017
    Assignee: IDEX ASA
    Inventor: Fred G. Benkley, III
  • Patent number: 9569654
    Abstract: A sensing module, such as a fingerprint sensing module, is disclosed. The sensing module includes a rigid substrate having a cutout, a flexible substrate attached to the rigid substrate, an image sensor including conductive traces formed on the flexible substrate, and a sensor integrated circuit that is connected to the conductive traces of the image sensor. The sensor integrated circuit is disposed in the cutout of the rigid substrate. The sensor integrated circuit can be fully enclosed in the cutout or disposed between the flexible substrate and the rigid substrate. The flexible substrate can also have a sensing side and a circuit side, where the conductive traces are formed on the circuit side and a finger is configured to be received from the sensing side. The conductive traces on the flexible substrate can also form a plurality of sensor gaps between respective image drive plates and image pickup plates.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: February 14, 2017
    Assignee: Synaptics Incorporated
    Inventor: Fred G. Benkley, III
  • Publication number: 20160379035
    Abstract: A sensor has parallel upper pickup lines in an upper conductive layer, parallel lower pickup lines in a lower conductive layer, parallel drive lines oriented transversely to the upper and lower pickup lines in a middle conductive layer, a first insulating layer separating the upper pickup lines from the drive lines, and a second insulating layer opposite the first insulating layer and separating the lower pickup lines from the drive lines. Upper electrode pairs are defined at locations where an upper pickup electrode crosses a drive line, and each upper electrode pair has an impedance that is sensitive to a first object contacting or in close proximity to the upper electrode pair. Lower electrode pairs are defined at locations where a lower pickup line crosses a drive line, and each lower electrode pair has an impedance that is sensitive to a second object contacting or in close proximity to the lower electrode pair.
    Type: Application
    Filed: June 22, 2016
    Publication date: December 29, 2016
    Applicant: IDEX ASA
    Inventor: FRED G. BENKLEY, III
  • Publication number: 20160188951
    Abstract: A sensor has drive lines and transverse pickup lines to define an electrode pair where each pickup line crosses a drive line. A reference pickup line is arranged parallel to the pickup lines and a compensation drive line is arranged parallel to the drive lines. A signal source provides a first signal to the drive lines and a second signal that is the inverse of the first signal to the compensation drive line. An amplifier has a first input connected to a pickup line, a second input connected to a reference pickup line, and a output indicative of an object in contact with the electrode pair(s). Each impedance between the compensation drive line and a pickup line, between the reference pickup line and a reference drive line, and between the compensation drive line and the reference pickup line is equal to the impedance at the electrode pair when no object is contact with the electrode pair.
    Type: Application
    Filed: December 24, 2014
    Publication date: June 30, 2016
    Applicant: IDEX ASA
    Inventor: Fred G. BENKLEY, III
  • Publication number: 20160154988
    Abstract: An novel sensor is provided having a plurality of substantially parallel drive lines configured to transmit a signal into a surface of a proximally located object, and also a plurality of substantially parallel pickup lines oriented proximate the drive lines and electrically separated from the pickup lines to form intrinsic electrode pairs that are impedance sensitive at each of the drive and pickup proximal locations.
    Type: Application
    Filed: November 19, 2015
    Publication date: June 2, 2016
    Applicant: IDEX ASA
    Inventor: FRED G. BENKLEY, III