Abstract: A lifting device for safely gripping and moving compressed gas cylinders is provided. The lifting device comprises a first and a second gripping element that slide over the top of the compressed gas cylinder and a plurality of gasket elements that engage the cylinder by friction as the lifting device scissors together permitting a user to safely move the cylinder.

Abstract: A lifting device for safely gripping and moving compressed gas cylinders is provided. The lifting device comprises a first and a second gripping element that slide over the top of the compressed gas cylinder and a plurality of gasket elements that engage the cylinder by friction as the lifting device scissors together permitting a user to safely move the cylinder.

Abstract: A stackable heat sink having a core shaft in heat-engaging relation with a semiconductor device and a plurality of individual thin fins having an opening for receiving the core shaft in press fit relation so that a plurality of the fins, when mounted on the shaft, define a plurality of air passageways and the fins and shaft efficiently transfer heat away from the semiconductor device and into the surrounding atmosphere. In an improved version of the heat sink, the heat-dissipating fins may be corrugated so as to increase the surface area of each individual fin without increasing its perimeter. A heat pipe may be used in conjunction with the core shaft or base of the heat sink so as to facilitate heat transfer away from the electronic component. An improved heat sink may also include a base having a plurality of openings and a small fan connected to the portion of the base with the openings, so as to direct air across and between adjacent fins.

Abstract: A heat sink retainer clip for attaching a heat sink to an electronic device and its housing such as a microprocessor module. The clip is comprised of flexible rails having slots that corresponding pins are inserted through. The pins are inserted vertically through registered openings in the heat sink and microprocessor module, and through corresponding holes in the retainer clip. Then the clip is expanded by a handle causing the pins to slide horizontally through the slots and lock into place because the size of the bulb at one end of the pin is larger than the width of the slot. Each pin also contains a spacer for maintaining a fixed distance between components of the microprocessor module and heat sink.

Abstract: A stackable heat sink having a core shaft in heat-engaging relation with a semiconductor device and a plurality of individual thin fins having an opening for receiving the core shaft in press fit relation so that a plurality of the fins, when mounted on the shaft, define a plurality of air passageways and the fins and shaft efficiently transfer heat away from the semiconductor device and into the surrounding atmosphere. In an improved version of the heat sink, the heat-dissipating fins may be corrugated so as to increase the surface area of each individual fin without increasing its perimeter. A heat pipe may be used in conjunction with the core shaft or base of the heat sink so as to facilitate heat transfer away from the electronic component. An improved heat sink may also include a base having a plurality of openings and a small fan connected to the portion of the base with the openings, so as to direct air across and between adjacent fins.

Abstract: A retainer clip for retaining a component to a board and a handle for handling the same.

Abstract: A stackable heat sink having a core shaft in heat-engaging relation with a semiconductor device and a plurality of individual thin fins having an opening for receiving the core shaft in press fit relation so that a plurality of the fins, when mounted on the shaft, define a plurality of air passageways and the fins and shaft efficiently transfer heat away from the semiconductor device and into the surrounding atmosphere.

Abstract: A heat dissipating assembly is provided wherein a heat emitting plate is clamped to the heat receiving base of a heat sink by means of a releasable spring loaded clip. The spring loaded clip includes a pressure plate, and legs which terminate in detente elements. The legs are adapted to extend through the two plates so as to position the detente elements on one side of the heat exchanging plates, and the pressure plate on the other. The spring loading, acting on the pressure plate, serves to clamp the two heat exchanging plates between the pressure plate and the detente elements. The spring loading also serves to urge the legs laterally so that the detente elements engage firmly with an opposed side of the heat emitting plate.