Abstract: A hybrid integrated circuit (10), having a plurality of chip carriers (12) mounted thereon, is positioned on a nest (50) of an apparatus (30). An operator, while activating pneumatic switches (58), moves a selected one of the plurality of chip carriers (12) to an inspection site. A sensor plunger (62) detects the presence of the chip carrier (12) and enables a positioning assembly (34), which centers the chip carrier within the inspection site and locks the nest (50), to prevent further movement thereof. A viewing adaptor (70) is then lowered about the selected chip carrier (12) to enable the operator to simultaneously inspect all solder joints (22) positioned beneath the selected chip carrier. Thereafter, the operator releases switch actuator (60) which allows the viewing adaptor (70) to be raised and enables the positioning assembly (34) to unlock the nest (50) so that another chip carrier (12) may be moved to the inspection site for inspection by the operator.

Abstract: A thermocompression bonding apparatus (10), which is particularly adapted to bond an array of miniaturized electrical leads (36) to a corresponding array of respectively aligned pads (33) of a metallized circuit, supported on a substrate (31), includes a specially constructed and internally heated bonding thermode (12) that is uniquely pin-coupled at an upper surface midpoint portion thereof to the lower end of a single support rod (54). The latter is resiliently supported at its upper end, preferably through the use of a plurality of coaxially mounted Belleville washers (77), within an oversized central bore of a three-plate support assembly (14). The latter is, in turn, adapted to be secured to a reciprocally driven member, such as a multipost-mounted platen (16), of the composite apparatus.