Abstract: Implementations generally relate to a user interaction platform. In some implementations, a method includes providing one or more target functions to a user interaction device, where the one or more target functions enable user interaction with a primary device. The method also includes receiving user-defined configuration information for the one or more target functions. The method also includes configuring the one or more target functions based on the user-defined configuration information.

Abstract: Implementations generally relate to a user interaction platform. In some implementations, a method includes providing one or more target functions to a user interaction device, where the one or more target functions enable user interaction with a primary device. The method also includes receiving user-defined configuration information for the one or more target functions. The method also includes configuring the one or more target functions based on the user-defined configuration information.

Abstract: A system and method for deprocessing a semiconductor die is disclosed. The semiconductor dies has an active area and at least one feature in the active area. The method and system include tuning an ablation laser. The method and system further include ablating a first portion of the semiconductor die using a tuned ablation laser to mark a location of the feature. The first portion is distinct from the active area and has a center. The center of the first portion is substantially above the feature. The method and system also include deprocessing a second portion of the semiconductor die using the first portion as a guide.

Abstract: A system and method for detecting at least one fault in at least one circuit of a flip-chip package is disclosed. The circuit located on a first portion of a semiconductor die. The method and system include the steps of thinning the semiconductor die without destroying the at least one circuit. The method and system further include applying a liquid having a high evaporation rate in a layer on at least a portion of an exposed surface of the semiconductor die after thinning and applying power to the at least one circuit. The method and system also include determining where at least one portion of the liquid has evaporated from the exposed surface of the semiconductor die to detect the at least one fault.

Abstract: Aspects for topside analysis of an integrated circuit die mounted in a flip-chip orientation are described. In an exemplary method aspect, the method includes isolating the multi-layer integrated circuit die from the flip-chip package, and exposing the multilayer integrated circuit die. The method further includes testing selected areas of the multi-layer integrated circuit die from a topside utilizing critical paths placed in a predetermined arrangement around edges of the multi-layer integrated circuit die.