Abstract: Disclosed herein are heterojunction bipolar transistor (HBT) devices and methods of making and use thereof.

Abstract: A digital optical network (DON) is a new approach to low-cost, more compact optical transmitter modules and optical receiver modules for deployment in optical transport networks (OTNs). One important aspect of a digital optical network is the incorporation in these modules of transmitter photonic integrated circuit (TxPIC) chips and receiver photonic integrated circuit (TxPIC) chips in lieu of discrete modulated sources and detector sources with discrete multiplexers or demultiplexers.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: Electro-optic amplitude varying elements (AVEs) or electro-optic multi-function elements (MFEs) are integrated into signal channels of photonic integrated circuits (PICs) or at the output of such PICs to provide for various optical controlling and monitoring functions. In one case, such PIC signal channels may minimally include a laser source and a modulator (TxPIC) and in another case, may minimally include a photodetector to which channels, in either case, an AVE or an MFE may be added.

Abstract: Monolithic photonic integrated circuits (PICs) utilize forward error correction (FEC) joint encoder or plural encoders or a joint decoder or plural decoders.

Abstract: An optical transmitter comprises a monolithic transmitter photonic integrated circuit (TxPIC) chip that includes an array of modulated sources formed on the PIC chip and having different operating wavelengths approximating a standardized wavelength grid and providing signal outputs of different wavelengths. A wavelength selective combiner is formed on the PIC chip having a wavelength grid passband response approximating the wavelength grid of the standardized wavelength grid. The signal outputs of the modulated sources optically coupled to inputs of the wavelength selective combiner to produce a combined signal output from the combiner. A first wavelength tuning element coupled to each of the modulated sources and a second wavelength tuning element coupled to the wavelength selective combiner. A wavelength monitoring unit is coupled to the wavelength selective combiner to sample the combined signal output.

Abstract: Electro-optic amplitude varying elements (AVEs) or electro-optic multi-function elements (MFEs) are integrated into signal channels of photonic integrated circuits (PICs) or at the output of such PICs to provide for various optical controlling and monitoring functions. In one case, such PIC signal channels may minimally include a laser source and a modulator (TxPIC) and in another case, may minimally include a photodetector to which channels, in either case, an AVE or an MFE may be added.

Abstract: A method is disclosed for monitoring and controlling the bit error rate (BER) in an optical communication network where an optical receiver in the optical transmission network. The method includes the steps of decombining a combined channel signal received from the network and then monitoring a real time bit error rate (BER) of a decombined channel signal. The determined BER is then communicated, such as through an optical service channel (OSC) to an optical transmitter source that is the source of origin of the channel signal. Based upon the determined BER, the chirp of a channel signal modulator at the optical transmitter source that generated the monitored channel signal is adjusted by, for example, adjusting its bias. The same channel signal received at the optical receiver can be monitored again to determine if an acceptable level for the BER has been achieved by the previous chirp adjustment.

Abstract: Disclosed are compositions for anchoring materials in or to concrete or masonry. The compositions preferably comprise alkylacrylate ester monomer and a copolymer of alkylacrylate ester and methacrylic acid monomers, and free-radical catalyst.

Abstract: A method of tuning optical components integrated on a monolithic semiconductor chip having a plurality of first optical components integrated on the chip with each fabricated to approximate an emission wavelength along a given wavelength grid and together forming a first optical component wavelength grid. A second optical component is integrated on the chip with and optically coupled to the group of first optical components. The second optical component has a second optical component wavelength grid approximating the given wavelength grid where at least one emission peak along the second optical component wavelength grid is within an acceptable wavelength tolerance range of a particular first optical component of the first optical component wavelength grid but not the same as a corresponding emission wavelength of a particular first optical component.

Abstract: An optical transmitter comprises an array of modulated sources having different operating wavelengths approximating a standardized wavelength grid and providing signal outputs of different wavelengths. Signal outputs of the modulated sources are optically coupled to inputs of the wavelength selective combiner to produce a combined signal output from the combiner. The wavelength selective combiner has a wavelength grid passband response approximating the wavelength grid of the standardized wavelength grid. A first wavelength tuning element is coupled to each of the modulated sources and a second wavelength tuning element is coupled to the wavelength selective combiner. A wavelength monitoring unit is coupled to receive a sampled portion the combined signal output from the wavelength selective combiner. A wavelength control system is coupled to the first and second wavelength tuning elements and to the wavelength monitoring unit to receive the sampled portion of the combined signal output.

Abstract: A monolithic photonic integrated circuit (PIC) chip where the active waveguide cores of the modulated sources of the PIC are multiple quantum wells (MQWs) and the passive waveguide cores of an optical combiner are a bulk layer or material. The cores of the waveguide cores may be a quaternary such as InGaAsP or InAlGaAs.

Abstract: A method and apparatus operates an array of laser sources as an integrated array on a single substrate or as integrated in an optical transmitter photonic integrated circuit (TxPIC) maintaining the emission wavelengths of such integrated laser sources at their targeted emission wavelengths or at least to more approximate their desired respective emission wavelengths. Wavelength changing elements may accompany the laser sources to bring about the change in their operational or emission wavelength to be corrected to or toward the desired or target emission wavelength. The wavelength changing elements may be comprise of temperature changing elements, current and voltage changing elements or bandgap changing elements.

Abstract: Cleaved grooves, also referred to herein as “cleave streets”, are formed exclusively in a wafer passivation layer overlaying a wafer to provide for correctly aligned and sharp cleaves prior to singulation of the wafer into separate die or chips.