Abstract: Quantum well thermoelectric modules and a low-cost method of mass producing the modules. The devices are comprised of n-legs and p-legs, each leg being comprised of layers of quantum well material in the form of very thin alternating layers. In the n-legs the alternating layers are layers of n-type semiconductor material and electrical insulating material. In the p-legs the alternating layers are layers of p-type semiconductor material and electrical insulating material. In preferred embodiments the layers, referred to as superlattice layers are about 4 nm to 20 nm thick. The layers of quantum well material is separated by much larger layers of thermal and electrical insulating material such that the volume of insulating material in each leg is at least 20 times larger than the volume of quantum well material.

Abstract: A powder injection molding and infiltration process. A powder of a skeleton material having a relatively high melting point is mixed with a composite binder to form a mold mixture. The composite binder is comprised of at least two binder materials. The mold mixture is molded into a desired shape in a mold device to produce a molded part. The composite binder is then removed to produce voids in the molded part and the voids are filled by infiltrating an infiltrant comprised of an infiltrant material having a relatively low melting point to produce a composite molded part. In a preferred embodiment the skeleton material is TiB2 and the infiltrant material is aluminum and the composite binder is comprised of a plastic and a wax. In this embodiment the wax portion of the composite binder is removed using a solvent and the plastic is removed during the infiltration step. The resulting composite part has a TiB2 skeleton with voids substantially filled with aluminum.