Patents by Inventor Fred Perner

Fred Perner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6927092
    Abstract: A method of forming a shared global word line MRAM structure is disclosed. The method includes, etching a trench in an oxide layer formed over a substrate, depositing an first liner material, anisotropically etching the deposited first liner material leaving the first liner material on edges of the trench and physically contacting a bottom of the trench, depositing an magnetic metal liner material, anisotropically etching the deposited magnetic metal liner material leaving the magnetic metal liner material over the first liner material on edges of the trench, so that the magnetic metal liner extends to and physically contacts the bottom of the trench, depositing a conductive layer;, and chemically, mechanically polishing the conductive layer.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: August 9, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Heon Lee, Fred Perner
  • Patent number: 6665205
    Abstract: The invention includes an apparatus and a method that provides a shared global word line MRAM structure. The MRAM structure includes a first bit line conductor oriented in a first direction. A first sense line conductor is oriented in a second direction. A first memory cell is physically connected between the first bit line conductor and the first sense line conductor. A global word line is oriented in substantially the second direction, and magnetically coupled to the first memory cell. A second bit line conductor is oriented in substantially the first direction. A second sense line conductor is oriented in substantially the second direction. A second memory cell is physically connected between the second bit line conductor and the second sense line conductor. The global word line is also magnetically coupled to the second memory cell. The first memory cell and the second memory cell can be MRAM devices.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: December 16, 2003
    Assignee: Hewlett-Packard Development Company, LP.
    Inventors: Heon Lee, Fred Perner