Abstract: The present invention is drawn to a wire container comprising a plurality of spring-like wires having wave patterns forming a part support that minimize contact points between the container and one or more contained parts when the container is subjected to a vibration causing the wires and the parts to move, thereby eliminating any fixed contact points between the part and the supporting part support. Another aspect of the current invention is a process for removing penetrant from parts comprising: placing one or more parts with penetrant applied in a container having spring-like wire with wave patterns forming a part support; oscillating the container during a cleaning process thereby compressing and expanding one or more spring-like wires thus exposing part surfaces and removing the penetrant from the parts.

Abstract: The present invention is drawn to a wire container comprising a plurality of spring-like wires having wave patterns forming a part support that minimize contact points between the container and one or more contained parts when the container is subjected to a vibration causing the wires and the parts to move, thereby eliminating any fixed contact points between the part and the supporting part support. Another aspect of the current invention is a process for removing penetrant from parts comprising: placing one or more parts with penetrant applied in a container having spring-like wire with wave patterns forming a part support; oscillating the container during a cleaning process thereby compressing and expanding one or more spring-like wires thus exposing part surfaces and removing the penetrant from the parts.

Abstract: The present invention is drawn to a wire container comprising a plurality of spring-like wires having wave patterns forming a part support that minimize contact points between the container and one or more contained parts when the container is subjected to a vibration causing the wires and the parts to move, thereby eliminating any fixed contact points between the part and the supporting part support. Another aspect of the current invention is a process for removing penetrant from parts comprising: placing one or more parts with penetrant applied in a container having spring-like wire with wave patterns forming a part support; oscillating the container during a cleaning process thereby compressing and expanding one or more spring-like wires thus exposing part surfaces and removing the penetrant from the parts.

Abstract: A method and a pulse pressure sensor for sensing an arterial pulse pressure waveform. In one embodiment, the pulse pressure sensor includes a housing, a diaphragm, a piezoelectric device, and a self-contained amplifier. The skin-contact diaphragm is attached across a recess or opening in the housing. The piezoelectric device has a first portion mounted in a fixed relationship to the housing and a second portion displacementally coupled to the diaphragm. The solid-state amplifier has a signal input coupled to the piezoelectric device, wherein the piezoelectric device and amplifier together have a frequency response at least including a range from below approximately 0.1 hertz to above approximately 250 hertz. In one such embodiment, the housing and the skin-contact diaphragm of the sensor are stainless steel. In one such embodiment, the diaphragm has a skin-contact surface with a skin-contact dimension of between approximately 0.4 inch and 0.6 inch.