Patents by Inventor Fred Ren

Fred Ren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Aluminum bump bonding for fine aluminum wire
    Patent number: 8138081
    Abstract: The invention includes a packaged semiconductor device in which the bond wires are bonded to the leads with an aluminum bump bond. The semiconductor device is mounted on a leadframe having leads with a nickel plating. To form the bump bond between a fine aluminum wire, such as a 2 mil diameter wire, and the lead, an aluminum bump is bonded to the nickel plating and the wire is bonded to the bump. The bump is aluminum doped with nickel and is formed from a large diameter wire, such as a 6 mil diameter wire.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: March 20, 2012
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Adams Zhu, Xingquan Fang, Fred Ren, Yongsuk Kwon
  • ALUMINUM BUMP BONDING FOR FINE ALUMINUM WIRE
    Publication number: 20100035385
    Abstract: The invention includes a packaged semiconductor device in which the bond wires are bonded to the leads with an aluminum bump bond. The semiconductor device is mounted on a leadframe having leads with a nickel plating. To form the bump bond between a fine aluminum wire, such as a 2 mil diameter wire, and the lead, an aluminum bump is bonded to the nickel plating and the wire is bonded to the bump. The bump is aluminum doped with nickel and is formed from a large diameter wire, such as a 6 mil diameter wire.
    Type: Application
    Filed: October 16, 2009
    Publication date: February 11, 2010
    Inventors: Adams Zhu, Xingquan Fang, Fred Ren, Yongsuk Kwon
  • Aluminum bump bonding for fine aluminum wire
    Publication number: 20070216026
    Abstract: The invention includes a packaged semiconductor device in which the bond wires are bonded to the leads with an aluminum bump bond. The semiconductor device is mounted on a leadframe having leads with a nickel plating. To form the bump bond between a fine aluminum wire, such as a 2 mil diameter wire, and the lead, an aluminum bump is bonded to the nickel plating and the wire is bonded to the bump. The bump is aluminum doped with nickel and is formed from a large diameter wire, such as a 6 mil diameter wire.
    Type: Application
    Filed: March 20, 2006
    Publication date: September 20, 2007
    Inventors: Adams Zhu, Xingquan Fang, Fred Ren, Yongsuk Kwon