Abstract: Angular displacement of a flexible substrate is determined based on an electrical change of a mm-wave circuit associated with the flexible substrate. This electrical change may relate to, for example, one or more of a phase shift, an amplitude shift, a frequency shift, or a pulse shift. In some implementations the flexible substrate may include conductors on multiple layers whereby an angular displacement of the flexible substrate causes a relative displacement between conductors of different layers, thereby inducing the electrical change of the mm-wave circuit.

Abstract: Angular displacement of a flexible substrate is determined based on an electrical change of a mm-wave circuit associated with the flexible substrate. This electrical change may relate to, for example, one or more of a phase shift, an amplitude shift, a frequency shift, or a pulse shift. In some implementations the flexible substrate may include conductors on multiple layers whereby an angular displacement of the flexible substrate causes a relative displacement between conductors of different layers, thereby inducing the electrical change of the mm-wave circuit.

Abstract: A communications node for handling circuit and packet switching and capable of expansion to include multiple switching matrices, multiple network processors and multiple packet processors is disclosed. Each switch matrix has multipile I/O ports and communications with user interfaces, network interfaces and other system components via bidirectional data links. At least one switch matrix is connected via a bidirectional data link to a packet processor and a network processor. All processors are interconnected via a computer bus. Switch matrices are connected to each other either by a backplane bus or via bidirectional data links.

Abstract: A communication network made up of distributed switching stations controlled by a network control center. The distributed switches communicate with each other over long haul links and locally with users over short haul communication channels to user switches. Each user switch interfaces a distributed switch to a plurality of individual users. Communication is carried out in a Demand Assigned Multiple Access fashion with the distributed switches communicating with differential inbound and outbound data frame lengths. The outbound frames being shorter and in time division multiplexed (TDM) format. The inbound data frames from the user switches are longer and in time division multiple access (TDMA) format.

Abstract: A method of manufacture for forming a novel magnetic read/write transducer head of the type utilizing thin film materials. The method of manufacture comprises steps which deposit a thin film magnetic recording head on a selected substrate having dimensions which enable batch manufacture of a thin film magnetic transducer in combination with its supporting slider assembly. The substrate of selected material in large wafer form is subjected to a series of thin film deposition, etching and plating operations to form a plurality of thin film magnetic heads thereon. Thereafter, the substrate wafer is diced around each thin film magnetic transducer head with subsequent finishing and polishing to requisite shape thereby to yield the complete slider and transducer head assembly.

Abstract: A thin film magnetic head is disclosed which includes a substrate, a first layer of magnetic material having a first offset portion, a second layer of magnetic material having a second offset portion overlying the first offset portion, and a layer of conductor material disposed within the cavity defined by the two offset portions. In one embodiment the offset portion of the first magnetic layer is disposed within a recess in the substrate. In a second embodiment the offset portion of the first magnetic layer is disposed between two insulation layers mounted along the top surface of the substrate.

Abstract: A magnetic read/write transducer head of the type utilizing thin film materials. The method of manufacture comprises steps which deposit a thin film magnetic recording head on a selected substrate having dimensions which enable batch manufacture of a thin film magnetic transducer in combination with its supporting slider assembly. The substrate of selected material in large wafer form is subjected to a series of thin film deposition, etching and plating operations to form a plurality of thin film magnetic heads thereon. Thereafter, the substrate wafer is diced around each thin film magnetic transducer head with subsequent finishing and polishing to requisite shape thereby to yield the complete integrated slider and transducer head assembly.

Abstract: A thin film magnetic head is disclosed which includes a substrate, a first layer of magnetic material having a first offset portion, a second layer of magnetic material having a second offset portion overlying the first offset portion, and a layer of conductor material disposed within the cavity defined by the two offset portions. In one embodiment the offset portion of the first magnetic layer is disposed within a recess in the substrate. In a second embodiment the offset portion of the first magnetic layer is disposed between two insulation layers mounted along the top surface of the substrate.

Abstract: A method of manufacture for forming a novel magnetic read/write transducer head of the type utilizing thin film materials. The method of manufacture comprises steps which deposit a thin film magnetic recording head on a selected substrate having dimensions which enable batch manufacture of a thin film magnetic transducer in combination with its supporting slider assembly. The substrate of selected material in thick wafer form is subjected to a series of thin film deposition, etching and plating operations to form a plurality of thin film magnetic heads thereon. Thereafter, the substrate wafer is diced around each thin magnetic transducer head with subsequent finishing and polishing to requisite shape thereby to yield the complete slider and transducer head assembly.

Abstract: A high density magnetic read head is designed to yield an increased read signal. The width of the read head is reduced by folding a magnetoresistive sensor strip into U-shaped loops. The loops are folded one upon another in a plane perpendicular to the plane of the storage medium. By folding the sensor strip, the shape anisotropy of the sensor is increased and the single domain condition of the sensor in the desired direction is maintained.

Abstract: An improved drive coil for a magnetic domain memory device has varying separation between adjacent conductors to improve the uniformity of the magnetic field.