Abstract: The present invention related to a method for mechanically and electrically connecting an electric wire to a terminal element and to a terminal assembly comprising a terminal element and at least one electric wire that is mechanically and electrically connected to the terminal element. For improving such method and terminal assembly, the method comprises the steps of arranging a connecting portion of the electric wire substantially parallel to the an entrance surface of the contact opening; and connecting a joining section of the connecting portion with the contact opening by plastically deforming a lateral cut of the joining section.

Abstract: A method for manufacturing an electrical contact module is provided. First, a lead-frame of electrical conductors is formed, wherein at least one supporting strip is formed in the lead-frame of electrical conductors in such a way as to maintain the electrical conductors in a predetermined position with respect to each other. Then, the lead-frame of electrical conductors is over-molded with a first dielectric material, thereby obtaining a first over-molded lead-frame. At least one aperture is formed in the first over-molded lead-frame so that the at least one supporting strip is accessible. The at least one supporting strip in the first over-molded lead-frame is removed after completion of the over-molding step. A second dielectric material is then over-molded with the first over-molded lead-frame in such manner as to fill the at least one aperture and a space left between the electrical conductors after removal of the at least one supporting strip.

Abstract: A method for manufacturing an electrical contact module is provided. First, a lead-frame of electrical conductors is formed, wherein at least one supporting strip is formed in the lead-frame of electrical conductors in such a way as to maintain the electrical conductors in a predetermined position with respect to each other. Then, the lead-frame of electrical conductors is over-molded with a first dielectric material, thereby obtaining a first over-molded lead-frame. At least one aperture is formed in the first over-molded lead-frame so that the at least one supporting strip is accessible. The at least one supporting strip in the first over-molded lead-frame is removed after completion of the over-molding step. A second dielectric material is then over-molded with the first over-molded lead-frame in such manner as to fill the at least one aperture and a space left between the electrical conductors after removal of the at least one supporting strip.