Abstract: An EMI shield for use on a printed wiring board (PWB) of a circuit pack includes an open-ended box-like structure having a laterally extending flange completely encircling the opening into the box-like structure. The box is of an EMI impervious material, preferably stainless steel. An electrically conductive O-ring gasket is disposed in a groove in the flange. Both the groove and the flange completely encircle the box opening. The shield is secured to a PWB by pegs secured to the flange at positions radially outwardly of the gasket and extending entirely through openings through the PWB. Preferred pegs comprises pairs of side-by-side prongs integral with the shield flange but extending downwardly therefrom. Each prong terminates in an oppositely directed, return-bent detent with the detent pairs functioning as a spring-biased latch for removably mounting the shield to the PWB.

Abstract: Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.

Abstract: Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.