Patents by Inventor Freddie FOLIO

Freddie FOLIO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11088087
    Abstract: The present disclosure is directed to a micro module with a support structure. The micro module includes a carrier substrate having contacts and a bonding pad, a semiconductor die, and a support structure. The semiconductor die is positioned on the bonding pad and is electrically coupled to the contacts. The support structure is positioned on the bonding pad and adjacent to the semiconductor die. The support structure reinforces the bonding pad such that the bonding pad is more rigid than flexible. As a result, an external force applied to the micro module is less likely to cause the micro module to bend and damage the semiconductor die.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: August 10, 2021
    Assignee: STMicroelectronics, Inc.
    Inventors: Freddie Folio, Michael Tabiera, Edwin Graycochea, Jr.
  • Publication number: 20200035619
    Abstract: The present disclosure is directed to a micro module with a support structure. The micro module includes a carrier substrate having contacts and a bonding pad, a semiconductor die, and a support structure. The semiconductor die is positioned on the bonding pad and is electrically coupled to the contacts. The support structure is positioned on the bonding pad and adjacent to the semiconductor die. The support structure reinforces the bonding pad such that the bonding pad is more rigid than flexible. As a result, an external force applied to the micro module is less likely to cause the micro module to bend and damage the semiconductor die.
    Type: Application
    Filed: July 1, 2019
    Publication date: January 30, 2020
    Inventors: Freddie FOLIO, Michael TABIERA, Edwin GRAYCOCHEA, JR.