Abstract: A method for handling peripheral signals in an extensible three dimensional circuit includes forming an extensible three dimensional circuit with a plurality of stacked crossbar arrays and at least one class of traveling lines which travel vertically and laterally through the circuit. The method also includes alternating the traveling direction of bundles of traveling lines such that there are a substantially equal number of undriven lines and underutilized lines which exit out of a given side of the circuit and creating loopback traces which connect the undriven traveling lines and the underutilized traveling lines to form driven traveling lines with a full complement of memory elements and eliminate addressing gaps within the circuit.

Abstract: A low-cost high aspect ratio skived heatsink with high performance ducting in order to optimize airflow over and through the skived fins. The skived heatsink can additionally have formed channels or extruded holes for insertion of a heatsink pipe therein. A thermally enhanced compound is used between the heatsink and heatpipe to provide a low thermal resistance between the parts. The heatpipe is expanded to optimally fill the channel or hole by injecting pressured fluid into the pipe before sealing the pipe with working fluid, or via heating of a sealed pipe and expansion of the working fluid therein. A partitioned cooling system can additionally be used, one partitioned section having high volume airflow with low static pressure, and another partitioned section using higher velocity ducted air over a plurality of skived heatsinks.