Patents by Inventor Frederic Beaulieu
Frederic Beaulieu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8524596Abstract: Techniques for bond pad fabrication are provided. In one aspect, a method of forming a bond pad comprises the following steps. At least one alloying element is selectively introduced to at least a portion of at least one surface of the bond pad. The at least one alloying element is diffused into at least a portion of the bond pad through one or more thermal cycles. The at least one alloying element may be selectively introduced to the bond pad by depositing an alloying element layer comprising the at least one alloying element onto the bond pad and patterning and etching at least a portion of the layer.Type: GrantFiled: July 16, 2012Date of Patent: September 3, 2013Assignee: International Business Machines CorporationInventors: Frederic Beaulieu, Gobinda Das, Steven J. Duda, Matthew J. Farinelli, Adreanne Kelly, Samuel McKnight, William J. Murphy
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Publication number: 20120279767Abstract: Techniques for bond pad fabrication are provided. In one aspect, a method of forming a bond pad comprises the following steps. At least one alloying element is selectively introduced to at least a portion of at least one surface of the bond pad. The at least one alloying element is diffused into at least a portion of the bond pad through one or more thermal cycles. The at least one alloying element may be selectively introduced to the bond pad by depositing an alloying element layer comprising the at least one alloying element onto the bond pad and patterning and etching at least a portion of the layer.Type: ApplicationFiled: July 16, 2012Publication date: November 8, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Frederic Beaulieu, Gobinda Das, Steven J. Duda, Matthew J. Farinelli, Adreanne Kelly, Samuel McKnight, William J. Murphy
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Patent number: 7696631Abstract: Inner wire bond pads are formed within a peripheral region of a semiconductor chip and at least one bonding wire is attached to the inner wire bond pads. The semiconductor chip may be customized for a specific configuration of choice by wiring inner wire bond pads. Alternately, the bonding wires may be employed to reinforce a power network or a ground network. Further, the bonding wire may serve as a passive radio frequency (RF) component. In addition, the bonding wire may be used a heat conduction path to transfer heat from the semiconductor chip to the upper package housing.Type: GrantFiled: December 10, 2007Date of Patent: April 13, 2010Assignee: International Business Machines CorporationInventors: Frederic Beaulieu, Mukta G. Farooq, Kevin S. Petrarca
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Publication number: 20090146321Abstract: Inner wire bond pads are formed within a peripheral region of a semiconductor chip and at least one bonding wire is attached to the inner wire bond pads. The semiconductor chip may be customized for a specific configuration of choice by wiring inner wire bond pads. Alternately, the bonding wires may be employed to reinforce a power network or a ground network. Further, the bonding wire may serve as a passive radio frequency (RF) component. In addition, the bonding wire may be used a heat conduction path to transfer heat from the semiconductor chip to the upper package housing.Type: ApplicationFiled: December 10, 2007Publication date: June 11, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Frederic Beaulieu, Mukta G. Farooq, Kevin S. Petrarca
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Patent number: 7273804Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.Type: GrantFiled: January 6, 2005Date of Patent: September 25, 2007Assignee: International Business Machines CorporationInventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel Roy McKnight, Hiromitsu Miyai, Kevin Shawn Petrarca, Wolfgang Sauter, Richard Paul Volant, Caitlin W. Weinstein
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Publication number: 20060244138Abstract: Techniques for bond pad fabrication are provided. In one aspect, a method of forming a bond pad comprises the following steps. At least one alloying element is selectively introduced to at least a portion of at least one surface of the bond pad. The at least one alloying element is diffused into at least a portion of the bond pad through one or more thermal cycles. The at least one alloying element may be selectively introduced to the bond pad by depositing an alloying element layer comprising the at least one alloying element onto the bond pad and patterning and etching at least a portion of the layer.Type: ApplicationFiled: April 27, 2005Publication date: November 2, 2006Applicant: International Business Machines CorporationInventors: Frederic Beaulieu, Gobinda Das, Steven Duda, Matthew Farinelli, Adreanne Kelly, Samuel McKnight, William Murphy
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Publication number: 20060017566Abstract: A device, system and method for the detection of intrusion using radio frequency (RF) signals are provided. The system comprises at least two devices. The system detects intrusion by measuring the Received Signal Strength (RSS) of a RF signal sent by the first device to the second device via a RF channel. The RF signal receiving device determines if the variation of the current RSS value is due to an intrusion in the RF channel or not an acts appropriately.Type: ApplicationFiled: June 10, 2005Publication date: January 26, 2006Inventors: Jean-Louis Gauvreau, Alexandre Cervinka, Vincent Kassis, Frederic Beaulieu, Yvan Castilloux, Yves Tessier
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Patent number: 6946746Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.Type: GrantFiled: March 16, 2004Date of Patent: September 20, 2005Assignee: International Business Machines CorporationInventors: Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud
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Publication number: 20050121803Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.Type: ApplicationFiled: January 6, 2005Publication date: June 9, 2005Inventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel McKnight, Hiromitsu Miyai, Kevin Petrarca, Wolfgang Sauter, Richard Volant, Caitlin Weinstein
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Patent number: 6864578Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.Type: GrantFiled: April 3, 2003Date of Patent: March 8, 2005Assignee: International Business Machines CorporationInventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel Roy McKnight, Hiromitsu Miyai, Kevin Shawn Petrarca, Wolfgang Sauter, Richard Paul Volant, Caitlin W. Weinstein
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Publication number: 20040195642Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.Type: ApplicationFiled: April 3, 2003Publication date: October 7, 2004Inventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel Roy McKnight, Hiromitsu Miyai, Kevin Shawn Petrarca, Wolfgang Sauter, Richard Paul Volant, Caitlin W. Weinstein
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Publication number: 20040173893Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.Type: ApplicationFiled: March 16, 2004Publication date: September 9, 2004Applicant: International Business Machines CorporationInventors: Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud
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Patent number: 6737296Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.Type: GrantFiled: May 29, 2002Date of Patent: May 18, 2004Assignee: International Business Machines CorporationInventors: Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud
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Publication number: 20020145193Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.Type: ApplicationFiled: May 29, 2002Publication date: October 10, 2002Applicant: International Business Machines CorporationInventors: Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud
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Patent number: 6414386Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.Type: GrantFiled: March 20, 2000Date of Patent: July 2, 2002Assignee: International Business Machines CorporationInventors: Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud