Abstract: A LED lighting system includes a power supply, a LED controller, and a light guide plate having a top, a bottom, and an edge. A printed circuit board connected to the power supply is positioned at least partially under the bottom of the light guide plate. At least one surface-emitting LED is positioned on the printed circuit board adjacent to the light guide plate and directed to emit light vertically. A partially transmissive reflector is attached to extend between the top of the edge of the light guide plate and the printed circuit board to direct vertically emitted light from the at least one surface-emitting LED into the edge of the light guide plate.

Abstract: A light source useful for architectural lighting, general lighting, street lighting, or other lighting applications includes a plurality of light emitting diodes. A least some light emitting diodes can be sized between 30 microns and 500 microns. A plurality of micro-optics sized less than 1 millimeter are positioned over at least some of the plurality of light emitting diodes. A controller may be connected to selectively power groups of the plurality of light emitting diodes to provide different light beam patterns.

Abstract: A light source useful for architectural lighting, general lighting, street lighting, or other lighting applications includes a plurality of light emitting diodes. A least some light emitting diodes can be sized between 30 microns and 500 microns. A plurality of micro-optics sized less than 1 millimeter are positioned over at least some of the plurality of light emitting diodes and a controller is connected to selectively power groups of the plurality of light emitting diodes to provide different light beam patterns.

Abstract: A light source useful for architectural lighting, general lighting, street lighting, or other lighting applications includes a plurality of light emitting diodes, with at least some light emitting diodes sized between 50 microns and 500 microns. A plurality of micro-optics sized less than 1 millimeter are positioned over at least some of the plurality of light emitting diodes. Each combination of light emitting diode and associated micro-optic is positioned within a Rayleigh distance to each other, sufficient to both present a substantially uniform visual appearance and provide a substantially uniform light beam. In some embodiments the height of the light emitting diodes, their supporting substrate and electrical traces, and associated optics is less than 5 millimeters.

Abstract: A LED lighting system includes a power supply, a LED controller, and a light guide plate having a top, a bottom, and an edge. A printed circuit board connected to the power supply is positioned at least partially under the bottom of the light guide plate. At least one surface-emitting LED is positioned on the printed circuit board adjacent to the light guide plate and directed to emit light vertically. A partially transmissive reflector is attached to extend between the top of the edge of the light guide plate and the printed circuit board to direct vertically emitted light from the at least one surface-emitting LED into the edge of the light guide plate.

Abstract: A light source includes a plurality of light emitting diodes, with at least some light emitting diodes sized between 30 microns and 500 microns. A plurality of micro-optics are associated with a light guide plate and sized less than 1 millimeter, with each micro-optic positioned over at least one of the plurality of light emitting diodes. At least some of the combinations of light emitting diode and micro-optics associated with the light guide plate are positioned within a distance to each other sufficient to provide a substantially uniform light beam.

Abstract: A light source useful for architectural lighting, general lighting, street lighting, or other lighting applications includes a plurality of light emitting diodes. A least some light emitting diodes can be sized between 30 microns and 500 microns. A plurality of micro-optics sized less than 1 millimeter are positioned over at least some of the plurality of light emitting diodes and a controller is connected to selectively power groups of the plurality of light emitting diodes to provide different light beam patterns.

Abstract: A light source includes a plurality of light emitting diodes, with at least some light emitting diodes sized between 30 microns and 500 microns. A plurality of micro-optics are associated with a light guide plate and sized less than 1 millimeter, with each micro-optic positioned over at least one of the plurality of light emitting diodes. At least some of the combinations of light emitting diode and micro-optics associated with the light guide plate are positioned within a distance to each other sufficient to provide a substantially uniform light beam.

Abstract: A light source useful for architectural lighting, general lighting, street lighting, or other lighting applications includes a plurality of light emitting diodes, with at least some light emitting diodes sized between 50 microns and 500 microns. A plurality of micro-optics sized less than 1 millimeter are positioned over at least some of the plurality of light emitting diodes. Each combination of light emitting diode and associated micro-optic is positioned within a Rayleigh distance to each other, sufficient to both present a substantially uniform visual appearance and provide a substantially uniform light beam. In some embodiments the height of the light emitting diodes, their supporting substrate and electrical traces, and associated optics is less than 5 millimeters.

Abstract: A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer.

Abstract: A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer.

Abstract: An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

Abstract: An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

Abstract: An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

Abstract: A high efficiency light emitting diode (LED) comprised of a substrate, a buffer layer grown on the substrate (if such a layer is needed), a first active region comprising primary emitting species (PES) that are electrically-injected, a second active region comprising secondary emitting species (SES) that are optically-pumped by the light emitted from the PES, and photonic crystals, wherein the photonic crystals act as diffraction gratings to provide high light extraction efficiency, to provide efficient excitation of the SES, and/or to modulate the far-field emission pattern.

Abstract: A method and resultant device, in which metal nanoparticles are self-assembled into two-dimensional lattices. A periodic hole pattern (wells) is fabricated on a photoresist substrate, the wells having an aspect ratio of less than 0.37. The nanoparticles are synthesized within inverse micelles of a polymer, preferably a block copolymer, and are self-assembled onto the photoresist nanopatterns. The nanoparticles are selectively positioned in the holes due to the capillary forces related to the pattern geometry, with a controllable number of particles per lattice point.

Abstract: A method and resultant device, in which metal nanoparticles are self-assembled into two-dimensional lattices. A periodic hole pattern (wells) is fabricated on a photoresist substrate, the wells having an aspect ratio of less than 0.37. The nanoparticles are synthesized within inverse micelles of a polymer, preferably a block copolymer, and are self-assembled onto the photoresist nanopatterns. The nanoparticles are selectively positioned in the holes due to the capillary forces related to the pattern geometry, with a controllable number of particles per lattice point.