Patents by Inventor Frederic Diette

Frederic Diette has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic chip, component containing such a chip and manufacturing method
    Patent number: 8716843
    Abstract: Microelectronic chip including a semiconductor substrate; at least one area of its surface which is suitable to be electrically connected to a metal frame designed to accommodate the chip; at least one interconnect area formed by a copper-based conductive layer and comprising a connecting device, the interconnect area being connected to the area by a conductor, wherein the area is formed by a layer forming a copper diffusion barrier inserted between interconnect area and the substrate.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: May 6, 2014
    Assignees: STMicroelectronics S.A., STMicroelectronics (Crolles 2) SAS
    Inventors: Laurent Gay, Francois Guyader, Frederic Diette
  • MICROELECTRONIC CHIP, COMPONENT CONTAINING SUCH A CHIP AND MANUFACTURING METHOD
    Publication number: 20120273952
    Abstract: Microelectronic chip including a semiconductor substrate; at least one area of its surface which is suitable to be electrically connected to a metal frame designed to accommodate the chip; at least one interconnect area formed by a copper-based conductive layer and comprising a connecting device, the interconnect area being connected to the area by a conductor, wherein the area is formed by a layer forming a copper diffusion barrier inserted between interconnect area and the substrate.
    Type: Application
    Filed: April 25, 2012
    Publication date: November 1, 2012
    Applicants: STMicroelectronics (Crolles 2) SAS, STMicroelectronics S.A.
    Inventors: Laurent Gay, Francois Guyader, Frederic Diette