Abstract: The invention concerns an electronic module comprising: a printed circuit (10) including a flexible or semirigid substrate (12) provided with an array of strip conductors (14) deposited on each of its sides and with a plurality of contact pads (16) deposited on its upper side and connected to its array of conductor strips; at least an electronic chip (18), provided on its active surface with conductive bumps (20) respectively pressed on the contact pads; and a non-conductive adhesive layer (22) assembling the substrate and the chip. To avoid deformation of the module when the chip is being fixed by application of temperature and pressure, the substrate (12) is provided, on its lower side, with a plurality of reinforcing regions (24) arranged each opposite the contact pads (16).