Patents by Inventor Frederic Metral
Frederic Metral has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8158013Abstract: The invention relates to a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).Type: GrantFiled: June 23, 2009Date of Patent: April 17, 2012Assignee: SoitecInventors: Sebastien Kerdiles, Carine Duret, Alexandre Vaufredaz, Frédéric Metral
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Patent number: 8091601Abstract: The invention relates to equipment for carrying out a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).Type: GrantFiled: June 23, 2009Date of Patent: January 10, 2012Assignee: S.O.I.Tec Silicon on Insulator TechnologiesInventors: Sebastien Kerdiles, Carine Duret, Alexandre Vaufredaz, Frédéric Metral
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Patent number: 7919391Abstract: The invention concerns a method of treating one or both bonding surfaces of first and second substrates and in particular, the surfaces of donor and receiver wafers that are intended to be bonded together. A simultaneous cleaning and activation step is carried out immediately prior to bonding the wafers together, by applying to one or both bonding surfaces an activation solution of ammonia (NH4OH) in water, preferably deionized, at a concentration by weight in the range from about 0.05% to 2%. The method is applicable to fabricating structures used in the optics, electronics, or optoelectronics fields.Type: GrantFiled: June 2, 2005Date of Patent: April 5, 2011Assignee: S.O.I.Tec Silicon on Insulator TechnologiesInventors: Cécile Delattre, Frédéric Metral, Daniel Delprat, Christophe Maleville
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Patent number: 7718534Abstract: A method of planarization of a surface of a heteroepitaxial layer by chemical-mechanical polishing the disturbed surface of the heteroepitaxial layer with a polishing pad having a compressibility greater than 2% and less than 15% and a slurry comprising at least 20% of silica particles having an average diameter between about 70 and about 100 nm. This method allows to reach high polishing rates appropriated for eliminating surface defects on heteroepitaxial layers, such as crosshatch patterns, and to achieve, in the same time, a final polish that is desirable to facilitate further operations.Type: GrantFiled: December 7, 2006Date of Patent: May 18, 2010Assignee: S.O.I.Tec Silicon on Insulator TechnologiesInventors: Muriel Martinez, Frédéric Metral, Patrick Reynaud, Zohra Chahra
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Publication number: 20090294072Abstract: The invention relates to equipment for carrying out a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).Type: ApplicationFiled: June 23, 2009Publication date: December 3, 2009Inventors: Sebastien Kerdiles, Carine Duret, Alexandre Vaufredaz, Frédéric Metral
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Publication number: 20090261064Abstract: The invention relates to a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).Type: ApplicationFiled: June 23, 2009Publication date: October 22, 2009Inventors: Sebastien Kerdiles, Carine Duret, Alexandre Vaufredaz, Frederic Metral
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Patent number: 7601271Abstract: The invention relates to a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).Type: GrantFiled: February 17, 2006Date of Patent: October 13, 2009Assignee: S.O.I.Tec Silicon on Insulator TechnologiesInventors: Sebastien Kerdiles, Carine Duret, Alexandre Vaufredaz, Frédéric Metral
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Publication number: 20070119812Abstract: The invention relates to a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).Type: ApplicationFiled: February 17, 2006Publication date: May 31, 2007Inventors: Sebastien Kerdiles, Carine Duret, Alexandre Vaufredaz, Frederic Metral
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Publication number: 20070087570Abstract: A method of planarization of a surface of a heteroepitaxial layer by chemical-mechanical polishing the disturbed surface of the heteroepitaxial layer with a polishing pad having a compressibility greater than 2% and less than 15% and a slurry comprising at least 20% of silica particles having an average diameter between about 70 and about 100 nm. This method allows to reach high polishing rates appropriated for eliminating surface defects on heteroepitaxial layers, such as crosshatch patterns, and to achieve, in the same time, a final polish that is desirable to facilitate further operations.Type: ApplicationFiled: December 7, 2006Publication date: April 19, 2007Inventors: Muriel Martinez, Frederic Metral, Patrick Reynaud, Zohra Chahra
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Publication number: 20060141746Abstract: The invention concerns a method of treating one or both bonding surfaces of first and second substrates and in particular, the surfaces of donor and receiver wafers that are intended to be bonded together. A simultaneous cleaning and activation step is carried out immediately prior to bonding the wafers together, by applying to one or both bonding surfaces an activation solution of ammonia (NH4OH) in water, preferably deionized, at a concentration by weight in the range from about 0.05% to 2%. The method is applicable to fabricating structures used in the optics, electronics, or optoelectronics fields.Type: ApplicationFiled: June 2, 2005Publication date: June 29, 2006Inventors: Cecile Delattre, Frederic Metral, Daniel Delprat, Christophe Maleville
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Patent number: 7022586Abstract: The present invention relates to a method for recycling a substrate that has a residue on its surface and a detachment profile resulting from an implantation process. The method includes removing the residue from the substrate to a level substantially equivalent to that of the detachment profile, thus obtaining a substantially uniform planar surface on the substrate, and then polishing the entire surface of the substrate to eliminate defects.Type: GrantFiled: December 3, 2003Date of Patent: April 4, 2006Assignee: S.O.I.Tec Silicon on Insulator Technologies S.A.Inventors: Christophe Maleville, Fabrice Letertre, Thibaut Maurice, Carlos Mazure, Fredéric Metral
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Patent number: 6988936Abstract: A solution for rinsing a surface that has been planarized using a chemical-mechanical planarization (“CMP”) technique. The solution may be a surfactant solution introduced following the use of a polishing solution in the CMP technique. The surfactant solution acts to clear undesirable particles from the planarized surface and also can terminate “latent” effects from the polishing solution. A cleaning solution is generally injected after the rinsing solution for additional cleaning effects. A plate covered with a textured material such a fabric is usually applied to the surface during the polishing, rinsing, or cleaning steps.Type: GrantFiled: July 15, 2003Date of Patent: January 24, 2006Assignee: S.O.I.Tec Silicon on Insulator Technologies S.A.Inventors: Laurent Filipozzi, Frederic Metral
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Patent number: 6881596Abstract: The invention relates to a device and method for automatically determining the surface quality of a bonding interface between two wafers. The device includes a detector for automatically detecting a bonding wave at a predetermined measuring site to determine when bonding occurs at the measuring site, and a processing unit for automatically calculating the bonding speed based on a location of the measuring site and at least one other predetermined site.Type: GrantFiled: April 29, 2003Date of Patent: April 19, 2005Assignee: S.O.I. Tec Silicon on Insulator Technologies S.A.Inventors: Christophe Malville, Frédéric Metral
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Publication number: 20040112866Abstract: The present invention relates to a method for recycling a substrate that has a residue on its surface and a detachment profile resulting from an implantation process. The method includes removing the residue from the substrate to a level substantially equivalent to that of the detachment profile, thus obtaining a substantially uniform planar surface on the substrate, and then polishing the entire surface of the substrate to eliminate defects.Type: ApplicationFiled: December 3, 2003Publication date: June 17, 2004Inventors: Christophe Maleville, Fabrice Letertre, Thibaut Maurice, Carlos Mazure, Frederic Metral
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Publication number: 20040058626Abstract: A solution for rinsing a surface that has been planarized using a chemical-mechanical planarization (“CMP”) technique. The solution may be a surfactant solution introduced following the use of a polishing solution in the CMP technique. The surfactant solution acts to clear undesirable particles from the planarized surface and also can terminate “latent” effects from the polishing solution. A cleaning solution is generally injected after the rinsing solution for additional cleaning effects. A plate covered with a textured material such a fabric is usually applied to the surface during the polishing, rinsing, or cleaning steps.Type: ApplicationFiled: July 15, 2003Publication date: March 25, 2004Inventors: Laurent Filipozzi, Frederic Metral
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Publication number: 20040005727Abstract: The invention relates to a device and method for automatically determining the surface quality of a bonding interface between two wafers. The device includes a detector for automatically detecting a bonding wave at a predetermined measuring site to determine when bonding occurs at the measuring site, and a processing unit for automatically calculating the bonding speed based on a location of the measuring site and at least one other predetermined site.Type: ApplicationFiled: April 29, 2003Publication date: January 8, 2004Inventors: Christophe Malville, Frederic Metral
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Publication number: 20030194948Abstract: The invention provides a chemical-mechanical polishing machine for polishing a wafer of a material, the machine comprising a rotary polishing turntable, a polishing head comprising a non-rotary portion and a rotary portion, and means for delivering an abrasive to the surface of the polishing turntable. The machine is remarkable in the means for distributing the abrasive comprise a hollow abrasive delivery ring fitted with abrasive feed means, with a plurality of abrasive delivery orifices distributed over its bottom face, and fixing means enabling it to be secured to the non-rotary portion of the polishing head, the ring being disposed around the rotary portion in a plane that is substantially parallel to the plane of the polishing turntable, but that is spaced apart therefrom. The invention is applicable to polishing wafers of semiconductor material.Type: ApplicationFiled: April 8, 2003Publication date: October 16, 2003Inventor: Frederic Metral