Abstract: The present invention relates to a smart card body, a smart card, and a manufacturing process for the same, and in particular to smart cards used for subscriber identity modules (SIM) cards. To improve a process for the manufacture of a smart card body and a process for the assembly of a smart card in such a manner that a simple and adaptable process can be achieved for the manufacture of a smart card, a process for the manufacture of a smart card body (10) for incorporating a semiconductor chip is described, wherein the process comprises the formation of a lead frame (3) in a conductive layer (1), wherein the lead frame has first contacts (2) on a first surface and can be connected to the semiconductor chip on a second surface opposite the first surface, and the formation of a electrically insulating casing layer (11) on the second surface of the smart card body, wherein the casing layer (11) has a recess (12) for incorporating the semiconductor chip.