Patents by Inventor Frederic Pierre

Frederic Pierre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming reflowed solder ball with low melting point metal cap
    Patent number: 6344234
    Abstract: A method and structure for a solder interconnection, using solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate is disclosed. After a solder ball has been formed using standard methods it is reflowed to give the solder ball a smooth surface. A layer of low melting point metal, such as, bismuth, indium or tin, preferably, pure tin, is deposited on the top of the solder balls. This structure results in localizing of the eutectic alloy, formed upon subsequent low temperature joining cycle, to the top of the high melting solder ball even after multiple low temperature reflow cycles. This method does not need tinning of the substrate to which the chip is to be joined, which makes this method economical. It has also been noticed that whenever temperature is raised slightly above the eutectic temperature, the structure always forms a liquid fillet around the joint with copper wires.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: February 5, 2002
    Assignee: International Business Machines Corportion
    Inventors: Hormazdyar Minocher Dalal, Alexis Bitaillou, Kenneth Michael Fallon, Gene Joseph Gaudenzi, Kenneth Robert Herman, Frederic Pierre, Georges Robert
  • Reflowed solder ball with low melting point metal cap
    Patent number: 6259159
    Abstract: A method and structure for a solder interconnection, using solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate is disclosed. After a solder ball has been formed using standard methods it is reflowed to give the solder ball a smooth surface. A layer of low melting point metal, such as, bismuth, indium or tin, preferably, pure tin, is deposited on the top of the solder balls. This structure results in localizing of the eutectic alloy, formed upon subsequent low temperature joining cycle, to the top of the high melting solder ball even after multiple low temperature reflow cycles. This method does not need tinning of the substrate to which the chip is to be joined, which makes this method economical. It has also been noticed that whenever temperature is raised slightly above the eutectic temperature, the structure always forms a liquid fillet around the joint with copper wires.
    Type: Grant
    Filed: January 30, 1997
    Date of Patent: July 10, 2001
    Assignee: International Business Machines Corporation
    Inventors: Hormazdyar Minocher Dalal, Alexis Bitaillou, Kenneth Michael Fallon, Gene Jospeh Gaudenzi, Kenneth Robert Herman, Frederic Pierre, Georges Robert
  • Plush rabbit
    Patent number: D586230
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: February 10, 2009
    Inventor: Frederic Pierre