Abstract: The invention relates to a method for machining a part to be machined using a machining tool, in which at least a portion of the machining area, likely to be heated during the machining of the part, or a portion of the machining tool is cooled by dispensing liquid nitrogen to said machining area or said tool. Solid CO2 particles are also dispensed into the machining area. The invention also relates to an apparatus for implementing said method.

Abstract: An outfit for the construction of several complex industrial installations for the treatment of industrial fluids includes several assemblies of several functional modules, each adapted to perform an elementary operation. Each functional module includes at least one input and at least one output, as well as a local guide unit of the functional module provided with a communication interface. All the functional modules have the same assembly to carry out the same elementary operation and are standard. The functional modules are adapted to be associated functionally with each other in installations. The outfit moreover includes, for each industrial installation, a single central guide unit, adapted to guide the functional modules of the associated industrial installation.

Abstract: The invention relates to a control system for at least one production unit (3) of at least one product, on the basis of consumption data of the said product by at least one unit consuming this product, comprising:

Abstract: The present invention relates to a wave soldering process wherein an inert gas atmosphere is injected inside the wave soldering machine, the inert gas atmosphere having a temperature which might be controlled. Particularly, the atmosphere can be heated at the same or different temperatures before injection, for example in the preheating zones, in the machine. The atmosphere can also be cooled (or injected at ambient temperature) e.g. in the cooling zone. Various atmospheres can be used (similar or different from one zone to another). Also, maintaining the atmosphere under forced laminer flow conditions improves the quality of the solder joints. The thermal efficiency of the heat transfer between the atmosphere and the printed circuit boards is thus greatly enhanced, which means less solder defects, higher components density and decrease of energy consumption and inert gas flow rate.

Abstract: A circuit board is wave soldered as it is carried by a conveyor through a solder wave established in a solder reservoir. Disposed on both sides of the solder wave are gas plenums which discharge shield gas. Each gas plenum includes a top wall, a side wall, and a bottom wall. The side wall is spaced horizontally from the wave, and the bottom wall is submerged within the solder. The side and (optionally) top walls include orifices for directing shield gas (i) at high velocity toward the solder wave to protect the solder wave with an atmosphere of shield gas, and (ii) upwardly toward an underside of the circuit board to strip entrained air therefrom. Instead of being submerged within the solder, the bottom wall could be spaced above the solder and provided with orifices to emit shield gas downwardly between the plenum and solder reservoir to create an inert atmosphere above the solder.

Abstract: The present invention provides a method of forming a free standing shape made of a material containing refractory metal, which entails providing a mandrel in a CVD enclosure, injecting a refractory halide gas and a reducing gas in the enclosure, reacting the gases in the enclosure to generate a material containing refractory metal, growing a layer of the material containing refractory metal on the mandrel and removing the mandrel to obtain the free standing shape, wherein the reducing gases is a silicon hydride gas or a mixture thereof.

Abstract: The invention relates to a process for preparing interconnection substrates of hybrid circuits, comprising effecting on a support the deposition of a thick layer of ink or paste based on a non-noble metal, such as copper or other material having a "copper compatible" formulation, by carrying out in succession a preliminary drying for eliminating solvents at a temperature on the order of 100.degree. C. to 150.degree. C., a firing comprising:a) a temperature rise incorporating a stage for eliminating polymer resins,b) a sintering step at a temperature on the order of 600.degree. C. to 1000.degree. C., andc) a timed cooling,the firing being carried out under a substantially inert gas atmosphere (nitrogen and/or argon and/or helium), the atmosphere of the stage for eliminating the polymer resins having a content of water vapor lower than 15,000 ppm, preferably between 1,000 and 10,000 ppm, while the atmosphere for sintering at high temperature has a content of water vapor in any case lower than 1,000 ppm.

Abstract: Metallization of ceramics of the type comprising depositing a metallic paste based on molybdenum and/or tungsten and manganese on a ceramic substrate and effecting the sintering of the paste in an atmosphere having a predetermiend oxido-reduction potential, with a rise in and a maintenance of a temperature between 1300.degree. C. and 1600.degree. C., then cooling to ambient temperature, with production of an atmosphere by the addition to a pure neutral gas of a quantity of additional oxygen and a quantity of hydrogen at least sufficient to subsequently obtain by catalytic reaction the desired content of water vapour and contingently the excess content of hydrogen.

Abstract: The invention concerns the production of ceramic-metal multilayer components comrising effecting, after making up in the crude state, in particular by metallization and stacking of pre-cut raw ceramic bands, a simultaneous firing operation, termed cofiring, on the components under an atmosphere based on hydrogen or nitrogen or a mixture of hydrogen and nitrogen, having a regulated water vapor content at a temperature of first of all between 800.degree. C. and 1800.degree. C., and more precisely either at a moderately high temperature plateau between 800.degree. C. and 1300.degree. C. for certain ceramic materials such as codierite and metallic materials such as copper and nickel, or at a temperature plateau between about 1400.degree. C. and 1800.degree. C.

Abstract: The process comprises, after deposition of a layer of raw ink on a support having a high thermal dissipation, of the aluminium nitride type, effecting a preliminary drying of this ink at a temperature on the order of 100.degree. C. to 150.degree. C., then a firing comprising:(a) a temperature rise including a polymer resin eliminating stage,(b) a sintering plateau at a temperature on the order of 600.degree. C. to 1000.degree. C., and(c) a timed cooling,wherein the atmosphere of the polymer resin eliminating stage has an oxygen content of between 100 ppm and 5000 ppm, while the oxygen contents of the high temperature sintering atmosphere and of the cooling atmosphere must be lower than about 10 ppm.

Abstract: The invention relates to a process of making a high purity silicide target comprising the steps of providing a substrate in a CVD enclosure, evacuating said enclosure up to a pressure P1 which is at least equal to or smaller than 5.times.10.sup.-5 Torr, heating the substrate at a temperature T1, which is at least equal to or greater than 20.degree. C., injecting in said enclosure a refractory metal halide MXm having a purity, as far as metallic impurities are concerned, greater than 5N (99,999%) and a silicon hydride having a purity, as far as metallic impurities are concerned, greater than 6N (99,9999%) setting the pressure in the enclosure between about 0.01 Torr and the atmospheric pressure while maintaining the temperature in the CVD enclosure between about 20.degree. C.

Abstract: The invention concerns glass-metal sealing comprising effecting on a metallic piece, in particular an alloy based on iron and nickel or iron, nickel and cobalt, first of all a decarburization under an atmosphere, at a temperature of between 950.degree. C. and 1,150.degree. C., formed by hydrogen (10 to 99%), water vapor (1 to 8%), with a ratio hydrogen/water vapor higher than five, the possible remainder being nitrogen, then an oxidation under an atmosphere formed by an inert vector gas such as nitrogen, either at a temperature of 600.degree. C. to 800.degree. C. and with a water vapor content of 8% to 2%; or at a temperature of 900.degree. C. to 1,100.degree. C. and with a water vapor content of 4% to 0.5%; then establishing the connection.