Patents by Inventor Frederic Tilhac

Frederic Tilhac has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LEAD-FRAME CIRCUIT PACKAGE
    Publication number: 20140252570
    Abstract: A lead-frame circuit package comprises a die and a substrate located thereon to route radio frequency signals to/from the die. The package preferably comprises an exposed pad on the die to receive a power amplifier device wherein the substrate is used to provide high-Q elements such as RF chokes on signal paths to/from the power amplifier device. In this manner, the design benefits from the power capabilities and improved grounding of a lead-frame conductor, whilst also achieving the routeing capabilities and small scale advantages provided by a multi-layer printed circuit substrate.
    Type: Application
    Filed: May 22, 2014
    Publication date: September 11, 2014
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: GILLES MONTORIOL, THIERRY DELAUNAY, FREDERIC TILHAC
  • Lead-frame circuit package
    Patent number: 8736034
    Abstract: A lead-frame circuit package comprises a die and a substrate located thereon to route radio frequency signals to/from the die. The package preferably comprises an exposed pad on the die to receive a power amplifier device wherein the substrate is used to provide high-Q elements such as RF chokes on signal paths to/from the power amplifier device. In this manner, the design benefits from the power capabilities and improved grounding of a lead-frame conductor, whilst also achieving the routeing capabilities and small scale advantages provided by a multi-layer printed circuit substrate.
    Type: Grant
    Filed: February 24, 2005
    Date of Patent: May 27, 2014
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Gilles Montoriol, Jr., Thierry Delaunay, Frederic Tilhac
  • Lead-Frame Circuit Package
    Publication number: 20080142935
    Abstract: A lead-frame circuit package comprises a die and a substrate located thereon to route radio frequency signals to/from the die. The package preferably comprises an exposed pad on the die to receive a power amplifier device wherein the substrate is used to provide high-Q elements such as RF chokes on signal paths to/from the power amplifier device. In this manner, the design benefits from the power capabilities and improved grounding of a lead-frame conductor, whilst also achieving the routeing capabilities and small scale advantages provided by a multi-layer printed circuit substrate.
    Type: Application
    Filed: February 24, 2005
    Publication date: June 19, 2008
    Applicant: Freescale Semicondutor, Inc.
    Inventors: Gilles Montoriol, Thierry Delaunay, Frederic Tilhac