Abstract: Making patterned electrically conductive structures, such as circuit elements, in single or multiple laminar form. The basic laminar structure is made by forming and filling an intaglio pattern in a non-conductive sheet with solidifiable electrically conductive material in pliable form, bonding the respective conductive and non-conductive materials in place and together, and removing the sheet portion underlying the conductive pattern to leave both the conductive and the non-conductive materials bonded laterally as a single lamina. Face-to-face juxtaposition of like or unlike laminae so made provides built-up or laminated products.

Abstract: Patterned laminar electrical interconnection, such as in the form of wiring harness, preferably including integrally formed end connectors, and made of individual patterned electrically conductive laminae, each lamina having electrically conductive portions and non-conductive portions contiguous side-by-side from end-to-end thereof, and being respectively substantially homogeneous electrically through the lamina thickness face-to-face. Like and/or unlike laminae are juxtaposed and bonded together face-to-face for overtly three-dimensional interconnecting laminated structures.

Abstract: Patterned electrical circuitry in laminar form with foraminous substrate having been sized with conductive and non-conductive compositions in any desired side-by-side patterned configuration. The resulting lamina is substantially homogeneous electrically through any part of its thickness despite the interposition of fragmentary portions of the foraminous substrate, which may be made up of paper, polymeric film, or textile material.

Abstract: Patterned electrically conductive structures, such as circuit elements, in single or multiple laminar form, and their manufacture. The basic laminar structure is made by sizing a removable substrate to substantially equal depth with an electrically conductive material over a given area configured as a circuit element and with an electrically non-conductive material elsewhere, bonding the respective sizing materials in place and together, and separating the substrate to leave a lamina of electrically conductive and non-conductive materials side-by-side. Face-to-face juxtaposition of such substrate-less laminae provides built-up or laminated products.