Abstract: A solid-state emitter grow light assembly comprises a main housing, configured for providing secure attachment and positioning of one or more individual modular array strips. A plurality of emitter arrays are each configured for mounting to an individual modular array strip. Each of the plurality of emitter arrays including a plurality of solid-state emitters mounted on a printed circuit board. The solid-state emitters are user selectable to emit light of a desired color spectrum. A plurality of pushed pin fasteners secure each emitter array to a modular array strip and each modular array strip to said Main housing. A plurality of driver modules are coupled to and configured for energizing one or more of the solid State emitters.

Abstract: An illumination system which houses LEDs on Printed Circuit Boards (PCB) in a lightweight, metal or plastic housing that can be configured as a stand-alone interior lighting fixture or retrofitted to a common two, three, or four tube fluorescent drop in a ceiling (troffer) light fixture. The system can also be configured as an emergency/security/night light.

Abstract: An illumination module that can be retrofitted to a common cobra head and shoebox style street and parking lot pole mounted light housings. This module can reduce the energy requirements by as much as 85%. The module also eliminates the typical required heat sinks. A self contained insect repulsion module that is “insect-tuned” is provided. This repulsion module is set at a frequency that discourages any infestation. A back-up photocell module turns the light “OFF” when the ambient light is above a certain threshold if the primary photocell fails. A lens housing structure substantially reduces extraneous upward and side illumination. The module can be retrofitted using only two simple steps, taking only about ten minutes using only common hand tools.

Abstract: A process for preparing a metal-coated hollow microsphere comprising the combination of steps of: (a) vigorously admixing a major quantity of hollow cenospheres/microspheres with a thermo-setting binder adhesive until the cenospheres are wet-out; (b) slowly adding metal flakes to the thus wet-out cenospheres of step (a) until the wet-out cenospheres are fully coated with the metal flakes; (c) binding the metal flakes to the said wet-out cenospheres by slowly increasing the temperature of the metal coated wet-out cenospheres from step (b), the temperature being raised up to about 350.degree. F.; and (d) the metal-coated cenospheres of step (c) are intermittently admixed in the absence of any further heating until dry. The dry product is ready for packaging.