Abstract: An apparatus and method of attenuating and/or conditioning optical energy for an optical transmitter, receiver or transceiver module is disclosed. An apparatus for attenuating the optical output of an optoelectronic connector including: a mounting surface; an array of optoelectronic devices having at least a first end; an array of optical elements having at least a first end; the first end of the array of optical elements optically aligned with the first end of the array of optoelectronic devices; an optical path extending from the first end of the array of optoelectronic devices and ending at a second end of the array of optical elements; and an attenuator in the optical path for attenuating the optical energy emitted from the array of optoelectronic devices. Alternatively, a conditioner may be adapted in the optical path for conditioning the optical energy emitted from the array of optoelectronic devices.

Abstract: A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber, and the optoelectronic device may be a vertical cavity surface emitting laser.

Abstract: This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment.

Abstract: This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing.

Abstract: An apparatus and method of modular manufacturing process for a parallel optical transmitter, receiver and/or transceiver is disclosed. The modular process assembles an array of optoelectronic devices to an array header to form an optoelectronic array package. Once the optoelectronic array package is assembled, it is tested and verified the functionality and alignment between the optoelectronic devices and optical fibers. The optoelectronic array package is subsequently coupled to an optical lens array to form an array optical subassembly. After the array optical subassembly is tested, it is coupled to an optical fiber connector to form an optical module. The optical module is then tested to verify its functionality and alignment.

Abstract: An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.

Abstract: An apparatus and method of modular manufacturing process for a parallel optical transmitter, receiver and/or transceiver is disclosed. The modular process assembles an array of optoelectronic devices to an array header to form an optoelectronic array package. Once the optoelectronic array package is assembled, it is tested and verified the functionality and alignment between the optoelectronic devices and optical fibers. The optoelectronic array package is subsequently coupled to an optical lens array to form an array optical subassembly. After the array optical subassembly is tested, it is coupled to an optical fiber connector to form an optical module. The optical module is then tested to verify its functionality and alignment.

Abstract: An attenuator or conditioner apparatus is provided that is used in conjunction with an optical transmitter, receiver or transceiver module. The apparatus functions to attenuate or condition optical energy emitted from optoelectronic devices.

Abstract: A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber, and the optoelectronic device may be a vertical cavity surface emitting laser.

Abstract: This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment.

Abstract: An optical power control system is provided that may be used in connection with an optical transmitter, receiver or transceiver module. The optical power control system comprises: (1) an array of optoelectronic devices; (2) an array of optical elements; (3) the array of optical elements optically aligned to the array of optoelectronic devices in such a manner that one or more optical elements is optically aligned to one or more optoelectronic devices; (4) a light-receiving device; and (5) a reflector proximate to the array of optical elements, the reflector optically orientated with the array of optoelectronic devices and the light-receiving device such that some emission from at least one optoelectronic device is reflected on at least a portion of the light-receiving device. The optical elements may be optical fibers and may be packaged in a ferrule. The light-receiving device may be a photo-detector or a light pipe.

Abstract: An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The apparatus comprises: (1) a mounting structure; (2) an array of optoelectronic devices adapted to the mounting structure, the optoelectronic devices having at least a first end; (3) an array of optical elements, the array of optical elements having at least a first end; (4) the first end of the array of optical elements proximate to the first end of the array of optoelectronic devices in such a manner that one or more optical elements is optically aligned to one or more optoelectronic devices; and (5) a heat spreader passing along a surface of a head region of the mounting structure. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region.

Abstract: This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an optoelectronic connector. The optoelectronic connector comprises: (1) a mounting structure; (2) an array of optoelectronic devices adapted to the mounting structure, the optoelectronic devices having at least a first end; (3) an array of optical elements, the array of optical elements having at least a first end; (4) the first end of the array of optical elements proximate to the first end of the array of optoelectronic devices in such a manner that one or more optical elements is positioned relative to one or more optoelectronic devices; and (5) a heat spreader passing along a surface of a head region of the mounting structure. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region.

Abstract: A multi-stage network which achieves the same overall connectivity as known networks but where individual switching nodes have no input selectivity and no output selectivity. Each node is enabled or disabled to control communication therethrough in response to a single control signal. The functionality of a switching network is achieved by controlling which nodes are enabled rather than specifying connections of particular node inputs and outputs to be effected by the nodes. In a photonic network embodiment, each network node is implemented using a single symmetric self electro-optic effect device (S-SEED).

Abstract: A network comprising a plurality of successively interconnected node stages where each node has an associated data connection state and includes a control element, significantly implemented as part of the node itself, for controlling the data connection state of at least one node of the following stage. The network is well suited for optical implementation and is controlled by shifting bits into the network for storage by the control elements rather than relying on spatial light modulators.

Abstract: A network arrangement and control method where, before any transmission of data occurs for a particular communication, a network controller determines an unused path to provide a connection, advantageously all the way through the network from a given inlet to a given outlet. Once the identity of the unused path is known, the controller determines control information for use in activating that path and transmits that control information into the network, significantly via the network inlets. The network responds by activating the determined path and communication is enabled via the activated path, but only for the single connection and no buffering of information is required within the network. The network is particularly well suited for optical implementation and control is effected without the use of spatial light modulators but rather by means of control elements embedded within the network itself.

Abstract: A multi-stage network which achieves the same overall connectivity as known networks but where individual switching nodes have no input selectivity and no output selectivity. Each node is enabled or disabled to control communication therethrough in response to a single control signal. The functionality of a switching network is achieved by controlling which nodes are enabled rather than specifying connections of particular node inputs and outputs to be effected by the nodes. In a photonic network embodiment, each network node is implemented using a single symmetric self electro-optic effect device (S-SEED).

Abstract: A reduced-blocking system where a perfect shuffle equivalent network having a plurality of node stages successively interconnected by link stages, is advantageously combined with expansion before the node stages and/or concentration after the node stages in a manner allowing the design of a system with arbitrarily low or zero blocking probability. An illustrative photonic system implementation uses free-space optical apparatus to effect a low loss, crossover interconnection of two-dimensional arrays of switching nodes comprising, for example, symmetric self electro-optic effect devices (S-SEEDs). Several low loss beam conbination techniques are used to direct multiple arrays of beams to an S-SEED array, and to redirect a reflected output beam array to a subsequent node stage.

Abstract: Optical apparatus for performing wavelength-dependent beam combination. The apparatus relies on a polarization beam splitter in combination with other optical elements to develop combined beams with the same polarization type and that are therefore suitable for polarization-dependent combination with other beam arrays. A dichroic mirror, which is used as the wavelength-dependent element of the apparatus, is oriented such that the incident beams are substantially perpendicular to the mirror. With this orientation, the dichroic mirror achieves near-ideal performance even with beam arrays having a substantial angular field. The apparatus also uses two plates which, although designed for operation as quarter-wave plates at one of the two wavelights being combined, are oriented with their respective fast axes substantially perpendicular to each other such that polarization conversions, effected by the plates on beams having the other of the two wavelengths, substantially cancel each other.

Abstract: A crossover network implemented using two-dimensional arrays of nodes. The network is a perfect shuffle equivalent network because it is topologically equivalent to a crossover network of one-dimensional arrays of nodes. The two-dimensional arrays are arranged in rows and columns and there are a plurality of link stages interconnecting successive arrays. The network is implemented efficiently in free space optics because the network topology requires optical crossovers in some link stages that interconnect only nodes in the same column of successive arrays and optical crossovers in the other link stages that interconnect only nodes in the same row of successive arrays.