Abstract: A photovoltaic module has a number of solar cells, which respectively include a contact structure on a pre-processed silicon wafer, which has a number of linear contact fingers disposed in parallel in a first direction and at least one bus bar disposed perpendicular to the first direction. The bus bar extends over the contact finger in a second direction and has a respective contact surface in the region of the contact finger, which protrudes above the contact finger in the second direction and is electrically connected to the contact fingers. At least one cell connector is provided for connecting the solar cells, which extends over the bus bar of at least one solar cell and is electrically connected to the contact surfaces of the bus bar, wherein the width of the cell connector is smaller than the length of the contact surface in the first direction.

Abstract: The present invention relates to a method of forming a metal layer on the surface of a photovoltaic cell by forming a first layer of a first composition on the surface of a silicon substrate and then forming a second layer of a second composition on the first layer, wherein both layers are in electrical contact with each other, the first composition comprises particles comprising or consisting of (i) B, Al, Ga, In, and/or Tl or (ii) P, As, Sb, and/or Bi, the second composition comprises metal particles, and wherein the particles of the first layer have a mean diameter smaller than the mean diameter of the metal particles of the second composition. Further, the present invention also relates to photovoltaic cells and solar modules obtainable using the method of the present invention.

Abstract: The invention relates to a method for masking a semiconductor substrate including the following steps: providing a planar semiconductor substrate having a first side and a second side lying opposite thereto, applying a mask to at least one of the sides, an extrusion printing method being used for applying the mask.

Abstract: A method for the production of a contact structure of a semiconductor component comprises the masking of at least one side of a semiconductor substrate with a coating and the partial removal thereof in at least one pre-determined region.

Abstract: The invention relates to a method for masking a semiconductor substrate comprising the following steps: providing a planar semiconductor substrate having a first side and a second side lying opposite thereto, applying a mask to at least one of the sides, an extrusion printing method being envisaged for applying the mask.

Abstract: A method for the production of a contact structure of a semiconductor component comprises the masking of at least one side of a semiconductor substrate with a coating and the partial removal thereof in at least one pre-determined region.

Abstract: A semiconductor component comprises a semiconductor substrate comprising a front surface, a back surface which is opposite thereto, and a surface normal which is perpendicular to the front and back surfaces, a first contact structure which is electrically conductive and is electrically connected to the front surface of the semiconductor substrate via at least one point-shaped front contact, and a second contact structure which is electrically conductive and is electrically connected to the back surface of the semiconductor substrate.