Abstract: A method of facing a substrate comprises applying a plurality of facing bodies to a carrier in a pattern corresponding to the desired pattern of the bodies on the faced substrate. The carrier has holes positioned centrally with respect to each body. Each body has, on a contact face to be fixed to the substrate, spaced raised weld elements which serve to locate the contact face parallel to and spaced from the substrate. The carrier is applied to the substrate with the contact faces of the bodies facing the substrate and then each body is electrically welded to the substrate by applying a welding tip to the body through each hole. A gap remains between the contact face and the substrate. Finally, the bodies are brazed to the substrate and brazing material flows between the bodies and the substrate. A facing kit comprises a carrier strip with facing bodies adhered thereto, each having raised weld elements in the form of dimples or lines.