Abstract: An electronic component with reduced capacitance includes a substrate (12) with an interconnect line (14), an additional substrate (11) with an interconnect line (13) wherein the substrate (12) overlies the additional substrate (11), an electronic device (15) overlying the substrate (12) and electrically coupled to the interconnect line (14) of the substrate (12), and an additional electronic device (17) having a lead (23) and an additional lead (26) wherein the lead (23) overlies the substrate (12) and is electrically coupled to the interconnect line (14) of the substrate (12) and wherein the additional lead (26) overlies the additional substrate (11) and is electrically coupled to the interconnect line (13) of the additional substrate (11).

Abstract: A novel circuit and method for providing amplitude and phase compensation for a balun in order to provide first and second voltage signals that are balanced has been provided. The compensation is achieved by adding an amplitude and phase compensation circuit such as a transmission line (14) or inductive (20) and capacitive (22) lumped elements in series with one of the ports of the balun on the balanced side. The amplitude and phase compensation circuit includes a characteristic impedance parameter (Zo) and an electrical length parameter (Eo) that are optimized such that the amplitude difference between first and second voltage signals is minimized, while the magnitude of the phase difference between first and second voltage signals is maximized.

Abstract: Hybrid RF amplifiers of improved performance are obtained by arranging film resistors, metallization and other components on a circuit board so that symmetrical parts of the electrical circuit are arranged in a mirror symmetrical fashion about a line extending along the circuit board and by aligning symmetrical resistors either parallel or orthogonal to this line and by utilizing common ground metal regions to terminate resistors that are aligned and orthogonal to the mirror line and spaced apart but joined to a common ground at a single location.