Patents by Inventor Frederick Charles Fiechter

Frederick Charles Fiechter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080172237
    Abstract: A method in support of fulfilling an e-commerce transaction between an outlet and a customer with respect to products not held in inventory by the outlet. When a customer selects one of the items not held in inventory by the outlet, the outlet transmits a purchase order to the provider; the provider then transmits a second purchase order for the selected product to a supplier and awaits an acceptance of the purchase order from the supplier. The supplier extracts the relevant data from the purchase order, obtains the selected product from its inventory, and packages and ships the selected product directly to the customer according to the branding requirements so as to insinuate delivery to the customer directly from the outlet. Preferably, the packaged product does not include any indication, or any in-the-clear indication, of the supplier fulfilling the e-commerce purchase order.
    Type: Application
    Filed: August 10, 2006
    Publication date: July 17, 2008
    Applicant: Sitoa Corporation
    Inventors: Calbert Lai, Frederick Charles Fiechter, Daniel Sheppard, Eric Hassman, Jackson Robie Hull
  • Patent number: 6253838
    Abstract: Disclosed is a casing for an electronic device which includes a heat dissipation layer, inner and outer insulative layers along either side of the heat dissipation layer, and a heat pipe which has a portion in thermal-transfer contact with the heat dissipation layer. The heat dissipation layer has a thermal conductivity in a first range whereas the insulative layers have a thermal conductivity in a different, lower range. Preferably, the inner layer is either thicker than the outer layer, has a lower thermal conductivity than the outer layer, or both. Vent holes can be provided through the heat dissipation layer, and, if so, the holes are preferably covered by either the inner or outer layers. Only a portion of the casing need have the foregoing heat dissipation layer, inner and outer insulative layers, and heat pipe.
    Type: Grant
    Filed: June 13, 2000
    Date of Patent: July 3, 2001
    Assignee: Applied Thermal Technology
    Inventors: Frederick Charles Fiechter, Patrick Griffin Quigley
  • Patent number: 6073684
    Abstract: Disclosed is a casing for an electronic device which includes a heat dissipation layer, inner and outer insulative layers along either side of the heat dissipation layer, and a heat pipe which has a portion in thermal-transfer contact with the heat dissipation layer. The heat dissipation layer has a thermal conductivity in a first range whereas the insulative layers have a thermal conductivity in a different, lower range. Preferably, the inner layer is either thicker than the outer layer, has a lower thermal conductivity than the outer layer, or both. Vent holes can be provided through the heat dissipation layer, and, if so, the holes are preferably covered by either the inner or outer layers. Only a portion of the casing need have the foregoing heat dissipation layer, inner and outer insulative layers, and heat pipe.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: June 13, 2000
    Assignee: Applied Thermal Technology
    Inventors: Frederick Charles Fiechter, Patrick Griffin Quigley