Patents by Inventor Frederick Evans Reed

Frederick Evans Reed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through via nub reveal method and structure
    Patent number: 9324614
    Abstract: A method includes applying a backside passivation layer to an inactive surface of an electronic component and to enclose a through via nub protruding from the inactive surface. The method further includes laser ablating the backside passivation layer to reveal a portion of the through via nub. The backside passivation layer is formed of a low cost organic material. Further, by using a laser ablation process, the backside passivation layer is removed in a controlled manner to reveal the portion of the through via nub. Further, by using a laser ablation process, the resulting thickness of the backside passivation layer is set to a desired value in a controlled manner. Further, by using a laser ablation process, the fabrication cost is reduced as compared to the use of chemical mechanical polish.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: April 26, 2016
    Inventors: Ronald Patrick Huemoeller, Frederick Evans Reed, David Jon Hiner, Kiwook Lee
  • Through via nub reveal method and structure
    Patent number: 8324511
    Abstract: A method includes applying a backside passivation layer to an inactive surface of an electronic component and to enclose a through via nub protruding from the inactive surface. The method further includes laser ablating the backside passivation layer to reveal a portion of the through via nub. The backside passivation layer is formed of a low cost organic material. Further, by using a laser ablation process, the backside passivation layer is removed in a controlled manner to reveal the portion of the through via nub. Further, by using a laser ablation process, the resulting thickness of the backside passivation layer is set to a desired value in a controlled manner. Further, by using a laser ablation process, the fabrication cost is reduced as compared to the use of chemical mechanical polish.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: December 4, 2012
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Frederick Evans Reed, David Jon Hiner, Kiwook Lee