Abstract: A system and method to display a plurality of different images at multiple distinct locations using a single image projector and an image propagation control means to control a propagation pathway from the projector to a display at each location.

Abstract: A current-driven display device includes sub-pixel drive circuits with integral photo-sensitive circuits that modify the respective sub-pixel drive currents as a function of the locally sensed ambient light level. The photo-sensitive circuit may include a photo-transistor or photo-resistor connected in the output circuit of a drive transistor used to control the on-off state of a respective sub-pixel element, or the photo-sensitive circuit may include a photo-resistor that adjusts a control voltage or current supplied to an input circuit of the drive transistor. In any event, the photo-sensitive circuits individually and independently adjust the drive current, and hence the luminance, of each sub-pixel element based on the locally sensed ambient light level to locally and dynamically compensate for changes in ambient light impinging on the display device.

Abstract: A vehicle parking locator system and method are provided. The system includes a database storing data pertaining to the vehicle parking locations including available parking locations, and a communication link for communicating with vehicles and other sources. The communication link receives parking location information including information pertaining to availability of parking locations and further provides vehicles with parking location information to assist in locating a parking location. The system further includes a processor for processing the stored data in the database and providing parking location information to vehicles.

Abstract: A test system and method of analyzing a pin to circuit connection on a substrate is provided. The method includes applying thermal energy to the pin or the substrate at a location outside of the pin to circuit interface, and measuring infrared radiation near the pin to circuit interface. The method also includes the step of analyzing the measured infrared radiation to determine thermal energy distribution near the pin to circuit interface resulting from thermal conductivity at the interface. The method further includes the step of determining sufficiency of the pin to circuit electrical and mechanical connection based on the determined thermal energy distribution.

Abstract: A test system and method of analyzing a pin to circuit connection on a substrate is provided. The method includes applying thermal energy to the pin or the substrate at a location outside of the pin to circuit interface, and measuring infrared radiation near the pin to circuit interface. The method also includes the step of analyzing the measured infrared radiation to determine thermal energy distribution near the pin to circuit interface resulting from thermal conductivity at the interface. The method further includes the step of determining sufficiency of the pin to circuit electrical and mechanical connection based on the determined thermal energy distribution.

Abstract: An electronic assembly includes a substrate and at least one surface mounted electronic component. The substrate includes a first side and a second side opposite the first side. The first side of the substrate includes a plurality of conductive traces formed thereon. The plurality of conductive traces includes a first conductive trace and a second conductive trace. The electronic component is electrically coupled between the first and second conductive traces. A component body of the electronic component is subject to interaction with a flux, which is utilized during electrical coupling of the electronic component to the first and second conductive traces, to form a current leakage path. The substrate is configured to prevent the formation of the current leakage path.