Abstract: According to one aspect of the invention, a system for handling microelectronic dies is provided. Two vertical supports are secured to the frame of the die handler. A wafer support, to support a semiconductor wafer, is mounted between the vertical supports such that the wafer can rotate about its central axis. An ejector arm track is mounted between the vertical supports below the wafer. An ejector arm is mounted to the track for rotation about the central axis of the wafer, and an ejector head is mounted to the ejector arm for translational movement along the ejector arm. A pick arm track is mounted between the vertical supports above the wafer. A pick arm is mounted to the track for rotation about the central axis of the wafer, and a pick head is mounted to the pick arm for translational movement along the pick arm.

Abstract: According to one aspect of the invention, a system for handling microelectronic dies is provided. A wafer support, to support a diced semiconductor wafer having microelectronic dies, is mounted to the frame. An ejector head is connected to the frame for movement below the wafer. A pick head is connected to the frame for movement above the wafer. The ejector head has a passageway therethrough and an intake and an outlet. An air pump is connected to the intake to shoot air from the outlet towards one of the dies. The air impinges the wafer support, exerting a force on the die, to assist the pick head in removing the die from the wafer support.

Abstract: According to one aspect of the invention, a system for handling microelectronic dies is provided. Two vertical supports are secured to the frame of the die handler. A wafer support, to support a semiconductor wafer, is mounted between the vertical supports such that the wafer can rotate about its central axis. An ejector arm track is mounted between the vertical supports below the wafer. An ejector arm is mounted to the track for rotation about the central axis of the wafer, and an ejector head is mounted to the ejector arm for translational movement along the ejector arm. A pick arm track is mounted between the vertical supports above the wafer. A pick arm is mounted to the track for rotation about the central axis of the wafer, and a pick head is mounted to the pick arm for translational movement along the pick arm.

Abstract: According to one aspect of the invention, a system for handling microelectronic dies is provided. A wafer support, to support a diced semiconductor wafer having microelectronic dies, is mounted to the frame. An ejector head is connected to the frame for movement below the wafer. A pick head is connected to the frame for movement above the wafer. The ejector head has a passageway therethrough and an intake and an outlet. An air pump is connected to the intake to shoot air from the outlet towards one of the dies. The air impinges the wafer support, exerting a force on the die, to assist the pick head in removing the die from the wafer support.

Abstract: A screen printing apparatus includes a source of solder paste. The solder paste further includes solder and flux. The screen printing apparatus also includes a stencil having openings therein, and an apparatus for forcing the solder paste into the openings of the stencil. The screen printing apparatus also includes a source of vibration attached to the stencil. In some embodiments, the source of vibration is an ultrasonic generator or a plurality of ultrasonic generators. The stencil can also include a frame. The source of vibration can be attached to the frame, or both the frame and the stencil. The source of vibration is positioned to overcome a surface tension between the solder paste and an opening in the stencil. A method for screen printing onto a substrate includes positioning a stencil having openings therein over a substrate, filling the openings in the stencil with solder paste, and vibrating the stencil to release the solder paste within the opening and deposit the solder paste onto the substrate.