Abstract: An apparatus is disclosed for intermittently feeding wire forward along a generally longitudinal axis, cutting and forming a front end of the wire at a first station into a jumper bridge for an electronic hybrid substrate and presenting the jumper bridge at a second station for removal from the apparatus.

Abstract: An apparatus for individually selecting a number of single in-line package (SIP) components and sequentially inserting them into a printed circuit board. The apparatus has a basic mode of operation, under a program control, comprising a shuttle assembly and a component pickup and insertion assembly, the shuttle assembly transferring a component from a selected one of a plurality of magazines and transferring the component to an unload station. At the unload station, the pickup and insertion assembly picks up the component from the shuttle assembly and rotates to a vertical position for insertion of the component in a printed circuit board. The printed circuit board is mounted on a pantograph mechanism whose position is controlled by a tape reader or a computer which also determines the automatic sequencing of the shuttle block.

Abstract: Under direction of a machine controller, a traversing shuttle automatically selects one component among a plurality of radially leaded components stored on continuous component belts, centers the component, shears the selected component from the belt, and conveys the component to a pivotable insertion head. The insertion head clamps onto the component leads, pivots and inserts the component leads into predrilled holes in a positioned printed circuit board. A mechanism beneath the board, cuts the leads and clinches the shortened leads to the board. The board is repositioned and another radial lead component of the same or different type and electrical size is selected and the cycle is repeated. Different spacings of components on the storage belts and different lead spacings are automatically accommodated.

Abstract: An apparatus for selecting predesignated transistor components from a plurality of loading stacks, transporting them to a pickup position by a shuttle mechanism, transferring them to an insertion head collet member, inserting them into a circuit board and clinching the leads thereof. The apparatus includes an X-Y axis positioning mechanism and a rotary holder for the circuit board that allows the components to be inserted into the circuit board at 0.degree., 90.degree., 180.degree. and 270.degree. orientations.