Abstract: A binary allow braze composition has been prepared and used in a bonded article of ceramic-ceramic and ceramic-metal materials. The braze composition comprises greater than approximately 95 wt % silver, greater than approximately 2 wt % hafnium and less than approximately 4.1 wt % hafnium, and less than approximately 0.2 wt % trace elements. The binary braze alloy is used to join a ceramic material to another ceramic material or a ceramic material, such as alumina, quartz, aluminum nitride, silicon nitride, silicon carbide, and mullite, to a metal material, such as iron-based metals, cobalt-based metals, nickel-based metals, molybdenum-based metals, tungsten-based metals, niobium-based metals, and tantalum-based metals. A hermetic bonded article is obtained with a strength greater than 10,000 psi.

Abstract: An apparatus and process for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid.

Abstract: An open-channel capillary is provided, having preferably a v-shaped groove in a flat wettable surface. The groove has timing marks and a source marker in which the specimen to be tested is deposited. The time of passage between the timing marks is recorded, and the ratio of surface tension .gamma. to viscosity .mu. is determined from the equation given below: ##EQU1## where h.sub.0 is the groove depth, .alpha. is the groove angle, .theta. is the liquid/solid contact angle, and t is the flow time. It has been shown by the inventors that the kinetics are only at most a weak function of K(.alpha.,.theta.); moreover, a wide range of theoretical assumptions show comparable numerical values for K(.alpha.,.theta.). .gamma..div..mu. and h.sub.0 are the only parameters. With the depth of the groove being an experimentally controllable parameter, the ratio of .gamma..div..mu. is the only free parameter. The value of .gamma..div..mu. can be determined from plots of z.sup.2 v.

Abstract: A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).

Abstract: Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

Abstract: A mercury switch device comprising a pool of mercury and a plurality of electrical contacts made of or coated with a non-wettable material such as titanium diboride.