Abstract: A boost purge ejector tee arrangement for a fuel vapor emissions system can include a boost purge ejector tee having a body that can define a first inlet port, a second inlet port and an outlet port. The first inlet port and the outlet port can be fluidly coupled along a first flow path. The body can define a second flow path from the second inlet port that can intersect the first flow path upstream of the outlet port. A nozzle can be positioned in the first flow path such that an outlet of the nozzle can be proximate the intersection of the second flow path with the first flow path. The boost purge ejector tee can be integrated into an air box that can be associated with an engine such that the outlet port exits into an inside of the air box.

Abstract: A boost purge ejector tee arrangement for a fuel vapor emissions system can include a boost purge ejector tee having a body that can define a first inlet port, a second inlet port and an outlet port. The first inlet port and the outlet port can be fluidly coupled along a first flow path. The body can define a second flow path from the second inlet port that can intersect the first flow path upstream of the outlet port. A nozzle can be positioned in the first flow path such that an outlet of the nozzle can be proximate the intersection of the second flow path with the first flow path. The boost purge ejector tee can be integrated into an air box that can be associated with an engine such that the outlet port exits into an inside of the air box.

Abstract: Disclosed is a method that deposits an aqueous material having a pH between approximately 10 and 11 in a first opening and on an oxide hard mask, deposits an organic material on the aqueous material, and patterns a photoresist over the organic material. The invention then etches the organic material and the aqueous material through the photoresist to form a second opening above the first opening and forms a polymer along sidewalls of the second opening. The invention can then perform a wet cleaning process using an alkali solution having a pH between approximately 10 and 11 to remove the aqueous material from the first opening. By utilizing an alkali aqueous (water-based) material having a pH of approximately 10-11, the invention can use a fairly low pH wet etch (pH of approximately 10-11) to completely remove the aqueous solution from the via, thereby eliminating the conventional problem of having residual organic material left within the via.