Abstract: An embodiment of the invention is a magnetic head with overlaid lead pads that contact the top surface of the sensor between the hardbias structures and do not contact the hardbias structures which are electrically insulated from direct contact with the sensor. The lead pad contact area on the top of the sensor is defined by sidewall deposition of a conductive material to form leads pads on a photoresist prior to formation of the remainder of the leads. The conductive material for the lead pads is deposited at a shallow angle to maximize the sidewall deposition on the photoresist, then ion-milled at a high angle to remove the conductive material from the field while leaving the sidewall material. An insulation layer is deposited on the lead material at a high angle, then milled at a shallow angle to remove insulation from the sidewall.

Abstract: A method for milling a structure. A single- or multi-layer resist having no undercut is added to a surface of a structure to be milled, the surface to be milled defining a plane. A milling process, such as ion milling, is performed. The milling process includes milling the structure at high incidence and milling the structure at razing incidence. The milling process can be performed only once, or repeated multiple times. High incidence can be defined as about 65 to about 90 degrees from the plane of the surface being milled. Razing incidence can be defined as about 0 to about 30 degrees from the plane of the surface being milled.

Abstract: A method of making a read sensor while protecting it from electrostatic discharge (ESD) damage involves forming a severable shunt during the formation of the read sensor. The method may include forming a resist layer over a plurality of read sensor layers; performing lithography with use of a mask to form the resist layer into a patterned resist which exposes left and right side regions over the read sensor layers as well as a shunt region; etching, with the patterned resist in place, to remove materials in the left and right side regions and in the shunt region; and depositing, with the patterned resist in place, left and right hard bias and lead layers in the left and right side regions, respectively, and in the shunt region for forming a severable shunt which electrically couples the left and right hard bias and lead layers together for ESD protection.

Abstract: A method for manufacturing a pole tip structure for a magnetic head is provided. An etch stop layer is initially deposited after which a transfer layer is deposited. Further deposited is at least one masking layer. Reactive ion etching is then performed to define a trench in at least the transfer layer. A pole tip layer is then deposited in the trench to define a pole tip structure flanked at least in part by the transfer layer. A surface of the transfer layer or etch stop layer then remains in co-planar relationship with a surface of the pole tip structure.

Abstract: A method is described which uses a CMP resistant metal layer to replace the upper dielectric layer in the track width definition phase of a TMR or CPP spin valve magnetic head. The metal which is selected to be resistant to the CMP process can be rhodium (Rh), platinum (Pt), chromium (Cr), vanadium (V), etc. The additional CMP resistance of the refill layer structure provides a much larger processing window which results in higher yields. A CPP head according to the invention has a metal layer according to the invention above the hard bias structures on the sides of the sensor which define the track width.

Abstract: The present invention is a magnetic head having a helical induction coil and includes hard disk drive devices that utilize the magnetic head. The helical coil is fabricated around a magnetic pole yoke in a series of process steps that include a reactive ion etch (RIE) process step which is utilized to simultaneously form vertical interconnect vias and upper helical coil member trenches. Thereafter, in a single fabrication step, such as by electroplating, the vertical interconnect lines and the upper helical coil traces are created in a single fabrication step, such that they are integrally formed. The vertical interconnect lines provide an electrical connection between outer ends of previously formed lower helical coil traces and outer ends of the integrally formed upper helical coil traces, such that a helical coil is fabricated. In the preferred embodiment, the helical coil is composed of copper.

Abstract: A method is described which uses a CMP slurry with an abrasive of spherical particles to lift-off photoresist used in the patterning of the sensor for a magnetic transducer. The spherical particles, preferably less than 0.015 microns, are preferably silica, alumina, titania or zirconia with colloidal silica being preferred. An alternative method of fabricating a CPP sensor structure according to the invention deposits a dielectric or CMP resistant metal over the hard bias structure. The CMP-resistant metal is preferably selected from the group consisting of rhodium, chromium, vanadium and platinum. A CMP resistant mask deposited over the dielectric or CMP-resistant metal can include an optional adhesion layer such as tantalum followed by a DLC layer. The CMP-assisted lift-off of the photoresist and the excess materials is executed at this point. The photoresist used to protect the selected area of the sensor structure is lifted-off using the slurry.

Abstract: A read head has a bottom lead made of material that is relatively polish resistant and a top lead layer that polishes down more easily than the bottom layer. With this structure, when the layers are deposited and then polished down, the top layer recesses away from the sensor (and bottom lead layer) in a controlled fashion, providing an acceptable lead structure that reduces the mismatch between the read head physical read width and magnetic read width.

Abstract: The present invention is a magnetic head having a helical induction coil and includes hard disk drive devices that utilize the magnetic head. The helical coil is fabricated around a magnetic pole yoke in a series of process steps that include a reactive ion etch (RIE) process step which is utilized to simultaneously form vertical interconnect vias and upper helical coil member trenches. Thereafter, in a single fabrication step, such as by electroplating, the vertical interconnect lines and the upper helical coil traces are created in a single fabrication step, such that they are integrally formed. The vertical interconnect lines provide an electrical connection between outer ends of previously formed lower helical coil traces and outer ends of the integrally formed upper helical coil traces, such that a helical coil is fabricated. In the preferred embodiment, the helical coil is composed of copper.

Abstract: A magnetic head having a helical induction coil. The helical coil is fabricated around a magnetic pole yoke in a series of process steps that include a reactive ion etch (RIE) process step which is utilized to simultaneously form vertical interconnect vias and upper helical coil member trenches. Thereafter, in a single fabrication step, such as by electroplating, the vertical interconnect lines and the upper helical coil traces are created in a single fabrication step, such that they are integrally formed. The vertical interconnect lines provide an electrical connection between outer ends of previously formed lower helical coil traces and outer ends of the integrally formed upper helical coil traces, such that a helical coil is fabricated. In the preferred embodiment, the helical coil is composed of copper.

Abstract: In a first aspect a slurry is provided for chemically mechanically polishing alumina and nickel iron to a common plane and in a second aspect a slurry is provided for additionally chemically mechanically polishing copper to a common plane. The slurry includes a first concentration of colloidal silica, a second concentration of potassium and/or sodium persulfate and a third concentration of ammonium persulfate. In the first aspect the first and second concentrations are tailored to chemically mechanically polish the alumina and the nickel iron at the same rate to a common plane and in the second aspect the slurry includes a third concentration of ammonium persulfate at a proper ratio to the potassium or sodium persulfate to chemically mechanically polish the copper at the same rate as the other materials to the same plane.

Abstract: A write head has a second pole tip layer, a coil layer and a write coil insulation layer that are planarized at their top surfaces. A thin top insulation layer insulates the top of the coil layer from a yoke portion of the second pole piece which is connected to the second pole tip layer in the pole tip region and connected to a first pole piece layer in a back gap region. In a preferred embodiment the write gap layer extends throughout the yoke region and provides the only insulation between the first pole piece layer and the coil layer. Further, it is preferred that the write coil insulation layer be an inorganic material such as silicon dioxide (SiO2). Several embodiments of the write head are provided along with novel methods of making.

Abstract: An apparatus and method of making is disclosed for a combination read/write head having improved topography. The disclosed read/write head combines a magnetoresistive (MR) read head with an inductive magnetic write head. The head is planarized at a second shield layer with a planarization layer such that pads and leads connecting the pads to the MR sensor and coil are on a planar surface of the planaritzation layer. This planarization layer allows first and second shield layers to be optimized for the MR sensor to be used and also separates the pads and leads from the substrate. The combination head has first and second shield layers formed on a substrate, the shield layers being separated by a read gap. A magnetoresistive (MR) sensor and MR leads are located in the read gap. The planarization layer is then formed on the substrate, surrounding the first and second shield layers creating a planar surface that is coplanar with a top surface of the second shield layer.

Abstract: A write head has a second pole tip layer, a coil layer and a write coil insulation layer that are planarized at their top surfaces. A thin top insulation layer insulates the top of the coil layer from a yoke portion of the second pole piece which is connected to the second pole tip layer in the pole tip region and connected to a first pole piece layer in a back gap region. In a preferred embodiment the write gap layer extends throughout the yoke region and provides the only insulation between the first pole piece layer and the coil layer. Further, it is preferred that the write coil insulation layer be an inorganic material such as silicon dioxide (SiO2). Several embodiments of the write head are provided along with novel methods of making.

Abstract: A write head has a second pole tip layer, a coil layer and a write coil insulation layer that are planarized at their top surfaces. A thin top insulation layer insulates the top of the coil layer from a yoke portion of the second pole piece which is connected to the second pole tip layer in the pole tip region and connected to a first pole piece layer in a back gap region. In a preferred embodiment the write gap layer extends throughout the yoke region and provides the only insulation between the first pole piece layer and the coil layer. Further, it is preferred that the write coil insulation layer be an inorganic material such as silicon dioxide (SiO2). Several embodiments of the write head are provided along with novel methods of making.

Abstract: A magnetic tunnel junction (MTJ) memory cell uses a biasing ferromagnetic layer in the MTJ stack of layers that is magnetostatically coupled with the free ferromagnetic layer in the MTJ stack to provide transverse and/or longitudinal bias fields to the free ferromagnetic layer. The MTJ is formed on an electrical lead on a substrate and is made up of a stack of layers.

Abstract: A magnetic tunnel junction (MTJ) magnetoresistive (MR) read head has one fixed ferromagnetic layer and one sensing ferromagnetic layer on opposite sides of the tunnel barrier layer, and with a biasing ferromagnetic layer in the MTJ stack of layers that is magnetostatically coupled with the sensing ferromagnetic layer to provide either longitudinal bias or transverse bias or a combination of longitudinal and transverse bias fields to the sensing ferromagnetic layer. The magnetic tunnel junction in the MTJ MR head is formed on an electrical lead on a substrate and is made up of a stack of layers.

Abstract: A magnetic tunnel junction (MTJ) magnetoresistive read head for a magnetic recording system has the MTJ device located between two spaced-apart magnetic shields. The magnetic shields, which allow the head to detect individual magnetic transitions from the magnetic recording medium without interference from neighboring transitions, also function as electrical leads for connection of the head to sense circuitry. Electrically conductive spacer layers are located at the top and bottom of the MTJ device and connect the MTJ device to the shields. The thickness of the spacer layers is selected to optimize the spacing between the shields, which is a parameter that controls the linear resolution of the data that can be read from the magnetic recording medium.