Abstract: A composition for a brazing slurry which will form solid connections below 1600.degree. C. The composition comprises, by weight, about 21% to 22% fine particle tungsten; about 7% to 8% calcium oxide; about 5% to 6% silicon dioxide; about 5% to 6% titanium dioxide; about 3% to 4% aluminum oxide; and about 55.5 % to 57.5 % of an organic binder.The composition is well suited to attaching leads to metallized patterns formed on ceramic substrate and can also be employed as the pattern forming material.

Abstract: A composition for a brazing slurry which will form solid connections below 1600.degree. C. The composition comprises, by weight, about 15% to 16.5% fine particle tungsten; about 5% to 6% calcium oxide; about 4% to 5% silicon dioxide; about 6% to 7% aluminum oxide; and about 67% to 70% of an organic binder.The composition is well suited to attaching leads to metallized patterns formed on ceramic substrate and can also be employed as the pattern forming material. When employed in electron discharge devices as a means of forming cathode and/or heater configurations, and for attaching leads thereto, the material is resistant to heater-cathode leakage.