Abstract: Apparatus including a support and purge gas supply prevents edge and backside coating on a wafer in manufacture of integrated circuits. Various enclosure elements and methods are disclosed for containing and directing purge gas, and a CVD system is provided incorporating the elements of the invention.

Abstract: A chuck in a coating chamber in a CVD system has a hearth for providing heat to a substrate and an interchangeable chuck surface mounted on the hearth for supporting a substrate to be coated during processing. In preferred embodiment there are a plurality of chucks in a system. Excessive coating on surfaces in the CVD chamber other than substrate surfaces to be coated is substantially removed periodically by venting the chamber and replacing the interchangeable chuck faces. Also in a preferred embodiment, an interlocking feature operable by temperature is provided to secure the chuck faces during operation and to release them for interchanging. Also in a preferred embodiment heat transfer between the hearth and the chuck is enhanced by rings and grooves that increase surface area for heat transfer.

Abstract: A compact, lightweight, printed circuit card antenna which is adaptable to a wide range of frequencies, including very low frequencies. The antenna includes a three-dimensional inductor formed on the card, a peripheral conductor stripe on one side of the card which provides a distributed capacitance to the end of the antenna (to cancel inductive effects and broaden its bandwidth), and a peripheral conductor on the opposite side of the card which provides a capacitance to ground (to tune the antenna to frequency), and a transmission line feed point which provides an impedance match to the associated printed circuit flat cable transmission line without the use of impedance matching circuits.